Research Profile

Frank Stam

Biography

I received a BSc and MEngSc (Mechanical Engineering) degree from the University Twente, The Netherlands in 1986 and 1989 respectively. After some consultancy work involving product/equipment development I joined Digital Equipment Corporation, Galway, Ireland as a project engineer from 1989 until 1992 in the Advanced Manufacturing Technology group. It involved  developing microelectronic interconnection processes such as Tape Automated Bonding (TAB) for Multi Chip Units (MCU's) used in mainframe computer systems. In conjunction with this I developed an Expert System to select solder joint designs for circuit assemblies comprising Integrated Circuit and other electronic components. In 1992 I started as a research scientist in the Tyndall National Institute (then National Microelectronics Research Centre) in Cork, Ireland, to further develop my expertise in the "advanced interconnect" area. Assembly processes such as solder and conductive adhesive flip-chip and encapsulated wirebonds for Chip-on-Board were investigated. In 1996 I became a Senior Research Scientist and worked on various topics like environmental electronics, lead-free soldering development and characterisation, sensor packaging, and microassembly of novel optical, acoustic and gas sensing devices. In 2002 I setup a Biomedical Microsystems team to utilise my microelectronics expertise for developing minimal invasive and implantable microsystems. This required combining sensing technologies (e,g, radiation detection, pressure & electrochemical sensing) with inductive powering, wireless communication, software and system integration. Novel medical devices such as a swallowable diagnostic capsule, a radiation monitoring endoscope, a deep brain stimulator, an oesophageal cancer treatment device, a retinal implant, a somatosensory provoked signal monitoring system, and a drop foot stimulation implant, are examples that were developed. In 2010 I started the coordination of an EU research project Heart-e-Gel in which Electroactive Hydrogels were used for treating cardiovascular diseases via minimal invasive delivery and deployment of the smart gels. Following from this I got involved in a combined EU (Ecsel JU) and Irish (EI) project INCITE on smart catheters, coordinated by Philips, in which an FFR pressure sensing solution was integrated in the outer wall of  a 2 FR (0.67mm diameter) catheter. Over time I have worked on 28 National and European funded research projects (as well as many industry funded projects).  

Research Grants

 ProjectFunding
Body
Start DateEnd DateAward
Microsystem integration based on electroactive polymer gels for cardiovascular applications.European Union01-SEP-1030-OCT-14€713,798.00
INCITE IR-2015-0029Enterprise Irl01-JAN-1531-MAR-18€373,153.00
EI FP/2010/674 Travel SupportEnterprise Irl04-JUN-1030-JUN-12€560.00
[EI REF: ATRP/01/336] {Stam, Dr. F} NEnterprise Irl01-JAN-0231-DEC-03€346,004.00
[EI Contract ST/2000/053]{Stam,Dr.F.} NEnterprise Irl01-OCT-0030-SEP-02€45,584.00
Travel SupportEnterprise Irl23-FEB-1023-MAY-10€900.00
[EI ATRP/02/415B] {Stam, Frank} NEnterprise Irl01-NOV-0231-OCT-05€174,800.00
EI Travel Support FP7 ICT02009-5Enterprise Irl22-JUN-0902-NOV-09€1,100.00

Publications

Book Chapters

 YearPublication
(1991)'Preliminary Study on Developing an Expert System for Tape Automated Bonding'
M. F. Ahmad, W.G. Sullivan (1991) 'Preliminary Study on Developing an Expert System for Tape Automated Bonding' In: Factory Automation and Information Management. Boca Raton, USA: CRC Press. [Details]

Peer Reviewed Journals

 YearPublication
(2016)'Crystallinity and mechanical effects from annealing Parylene thin films'
Jackson, N;Stam, F;O'Brien, J;Kailas, L;Mathewson, A;O'Murchu, C (2016) 'Crystallinity and mechanical effects from annealing Parylene thin films'. Thin Solid Films, 603 :371-376 [DOI] [Details]
(2015)'Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications'
Jackson, N;Stam, F (2015) 'Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications'. Journal of applied polymer science, 132 [DOI] [Details]
(2015)'A Cardiovascular Occlusion Method Based on the Use of a Smart Hydrogel'
Jackson, N,Verbrugghe, P,Cuypers, D,Adesanya, K,Engel, L,Glazer, P,Dubruel, P,Shacham-Diamand, Y,Mendes, E,Herijgers, P,Stam, F (2015) 'A Cardiovascular Occlusion Method Based on the Use of a Smart Hydrogel'. IEEE Transactions On Biomedical Engineering, 62 :399-406 [DOI] [Details]
(2013)'Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application'
Jesudoss, P;Mathewson, A;Wright, WMD;Stam, F (2013) 'Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application'. Microelectronics Reliability, 53 :452-462 [DOI] [Details]
(2007)'Voltammetric characterisation of silicon-based microelectrode arrays and their application to mercury-free stripping voltammetry of copper ions'
Berduque, A;Lanyon, YH;Beni, V;Herzog, G;Watson, YE;Rodgers, K;Stam, F;Alderman, J;Arrigan, DWM (2007) 'Voltammetric characterisation of silicon-based microelectrode arrays and their application to mercury-free stripping voltammetry of copper ions'. Talanta, 71 :1022-1030 [DOI] [Details]
(2001)'Application of amorphous silicon thin-film position-sensitive detector to optical rules'
Martins, R;Teodoro, P;Soares, F;Ferreira, I;Guimaraes, N;Fortunato, E;Borges, J;Jose, G;Groth, A;Schultze, L;Berndt, D;Reichel, F;Stam, F (2001) 'Application of amorphous silicon thin-film position-sensitive detector to optical rules'. Advanced Engineering Materials, 3 :174-177 [Details]
(2016)'Widening the bandwidth of vibration energy harvesters using aliquid-based non-uniform load distribution'
Nathan Jackson, Frank Stam, Oskar Olszewski, Hugh Doyle, Aidan Quinn, Alan Mathewson (2016) 'Widening the bandwidth of vibration energy harvesters using aliquid-based non-uniform load distribution'. Sensors and Actuators A-Physical, 246 (1):170-179 [DOI] [Details]
(2016)'Evaluation of a Gelatin Modified Poly(ɛ-Caprolactone) Film as a Scaffold for Lung Disease'
Aleksandra Kosmalaa, Michelle Fitzgerald, Eric Moore, Frank Stam (2016) 'Evaluation of a Gelatin Modified Poly(ɛ-Caprolactone) Film as a Scaffold for Lung Disease'. Analytical Letters,   [DOI] [CORA Link] [Details]
(2015)'Electromechanical Properties of Carbon Nanotube Infused Polyacrylamide Hydrogel'
Jackson, N;Sheehan, A;Hasan, M;Stam, F;Razeeb, KM (2015) 'Electromechanical Properties of Carbon Nanotube Infused Polyacrylamide Hydrogel'. Advances In Polymer Technology, 34 [DOI] [Details]
(2015)'An electro-responsive hydrogel for intravascular applications: an in vitro and in vivo evaluation'
Verbrugghe P, Verhoeven J, Coudyzer W, Verbeken E, Dubruel P, Mendes E, Stam F, Meuris B, Herijgers P (2015) 'An electro-responsive hydrogel for intravascular applications: an in vitro and in vivo evaluation'. Journal Of Materials Science, 26 (11)   [DOI] [CORA Link] [Details]
(2014)'A cardiovascular occlusion method based on the use of a smart hydrogel'
Nathan Jackson, P. Verbrugghe, D. Cuypers, K. Adesanya, L. Engel, P. Glazer, P. Dubruel, Y. Shacham-Diamand, E. Mendes, P. Herijigers, F. Stam (2014) 'A cardiovascular occlusion method based on the use of a smart hydrogel'. IEEE Transactions On Biomedical Engineering, [Details]
(2014)'Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications'
Jackson, Nathan and Stam, Frank (2014) 'Optimization of electrical stimulation parameters for electro-responsive hydrogels for biomedical applications'. Journal of applied polymer science, [Details]
(2013)'3-D Interdigitated electrodes for uniform stimulation of electro-responsive hydrogels for biomedical applications'
Jackson, Nathan and Cordero, Nicolas and Stam, Frank (2013) '3-D Interdigitated electrodes for uniform stimulation of electro-responsive hydrogels for biomedical applications'. Journal Of Polymer Science Part B-Polymer Physics, 51 (21):1523-1528 [DOI] [Details]
(2013)'High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films'
Smet, V,Jamal, M,Waldron, F,Stam, F,Mathewson, A,Razeeb, KM (2013) 'High-Temperature Die-Attach Technology for Power Devices Based on Thermocompression Bonding of Thin Ag Films'. Ieee Transactions On Components Packaging And Manufacturing Technology, 3 :533-542 [DOI] [Details]
(2013)'Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application'
Jesudoss, P,Mathewson, A,Wright, WMD,Stam, F (2013) 'Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application'. Microelectronics Reliability, 53 :452-462 [DOI] [Details]
(2007)'Voltammetric Characterisation of Silicon-Based Microelectrode Arrays and Their Application to Mercury-Free Stripping Voltammetry of Copper Ions'
Berduque, A, Lanyon, YH, Beni, V, Herzog, G, Watson, YE, Rodgers, K, Stam, F, Alderman, J, Arrigan, DWM; (2007) 'Voltammetric Characterisation of Silicon-Based Microelectrode Arrays and Their Application to Mercury-Free Stripping Voltammetry of Copper Ions'. Talanta, 71 (3):1022-1030 [DOI] [Details]
(2001)'The effect of power cycling on the reliability of lead-free surface mount assemblies'
Davitt, Elaine and Stam, Frank A and Barrett, John (2001) 'The effect of power cycling on the reliability of lead-free surface mount assemblies'. IEEE Transactions On Components and Packaging Technologies, 24 (2):241-249 [Details]
(2001)'Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints'
Stam, FA and Davitt, E (2001) 'Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints'. Microelectronics Reliability, 41 (11):1815-1822 [Details]
(2001)'Application of amorphous silicon thin-film position-sensitive detector to optical rules'
Martins, R,Teodoro, P,Soares, F,Ferreira, I,Guimaraes, N,Fortunato, E,Borges, J,Jose, G,Groth, A,Schultze, L,Berndt, D,Reichel, F,Stam, F (2001) 'Application of amorphous silicon thin-film position-sensitive detector to optical rules'. Advanced Engineering Materials, 3 :174-177 [Details]
(1999)'A simple modification of a flip-chip bonder to allow large area chip attach'
Fuchs, S and Rindelhardt, K and Barrett, J and Stam, F (1999) 'A simple modification of a flip-chip bonder to allow large area chip attach'. Microelectronics International, 16 (1):8-11 [Details]
(1998)'Evaluation of adhesive based flip-chip interconnect techniques'
Nagle, R and Stam, F and Barrett, J (1998) 'Evaluation of adhesive based flip-chip interconnect techniques'. International Journal of Microelectronics Packaging, 1 :187-196 [Details]
(1995)'CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY'
STAM, F,OGRADY, P,BARRETT, J (1995) 'CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY'. Journal Of Electronics Manufacturing, 5 :1-8 [Details]
(1993)'Macro Requirement Within a Simulation Interface'
Ahmad, M Munir and Stam, Frank A (1993) 'Macro Requirement Within a Simulation Interface'. Simulation, 60 (3):181-188 [Details]

Conference Publications

 YearPublication
(2017)SPIE Microtechnologies, Bio-MEMS and Medical Microdevices III
Frank Stam, Heikki Kuisma, Feng Gao, Jaakko Saarilahti, David Gomes Martins, Anu Kärkkäinen, Brendan Marrinan, and Sebastian Pintal (2017) Integration of a capacitive pressure sensing system into the outer catheter wall for coronary artery FFR measurements . In: Society of Photo-Optical Instrumentation Engineers (SPIE) eds. SPIE Microtechnologies, Bio-MEMS and Medical Microdevices III Barcelona. Spain,   [DOI] [CORA Link] [Details]
(2016)SENSORS AND ACTUATORS A-PHYSICAL
Jackson, N;Stam, F;Olszewski, OZ;Doyle, H;Quinn, A;Mathewson, A (2016) Widening the bandwidth of vibration energy harvesters using a liquid-based non-uniform load distribution SENSORS AND ACTUATORS A-PHYSICAL , pp.170-179 [DOI] [Details]
(2015)Eurosensors
N.Jackson, F. Stam, O. Olszewski, R. Houlihan, A. Mathewson (2015) Broadening the Bandwidth of Piezoelectric Energy Harvester using Liquid filled Mass Eurosensors [Details]
(2015)EUROSENSORS 2015
Jackson, N;Stam, F;Olszewski, OZ;Houlihan, R;Mathewson, A (2015) Broadening the bandwidth of piezoelectric energy harvesters using liquid filled mass EUROSENSORS 2015 , pp.328-332 [DOI] [Details]
(2011)2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)
Jesudoss, P;Mathewson, A;Twomey, K;Stam, F;Wright, WMD (2011) A Swallowable diagnostic capsule with a direct access sensor using anisotropic conductive adhesive 2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) [Details]
(2010)2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
Hilt, T;Boutry, H;Franiatte, R;Rothan, F;Sillon, N;Stam, F;Mathewson, A;Wang, NN;O'Mathuna, C;Rodgers, K (2010) DC/DC Converter 3D Assembly for Autonomous Sensor Nodes 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) , pp.834-839 [Details]
(2009)2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4
Stam, F;Razeeb, KM;Salwa, S;Mathewson, A (2009) Micro-Nano Interconnect between Gold Bond Pads and Copper Nano-Wires Embedded in a Polymer Template 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 , pp.1470-1474 [Details]
(2003)PROCEEDINGS OF THE IEEE SENSORS 2003, VOLS 1 AND 2
Norman, A;Stam, F;Ducso, C (2003) Reliability of micromachined catalytic gas sensors PROCEEDINGS OF THE IEEE SENSORS 2003, VOLS 1 AND 2 , pp.1310-1313 [Details]
(2002)SECOND JOINT EMBS-BMES CONFERENCE 2002, VOLS 1-3, CONFERENCE PROCEEDINGS
Piggott, JM;Berney, H;Hurley, E;Clair, J;Hofmann, M;Stam, F;Morrissey, A;Sheehan, MM (2002) Planar flexible electrode for use in wound sterilization SECOND JOINT EMBS-BMES CONFERENCE 2002, VOLS 1-3, CONFERENCE PROCEEDINGS , pp.1929-1930 [Details]
(1995)JOURNAL OF ELECTRONICS MANUFACTURING
STAM, F;OGRADY, P;BARRETT, J (1995) CHARACTERIZATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE-PITCH PACKAGE ASSEMBLY JOURNAL OF ELECTRONICS MANUFACTURING , pp.1-8 [Details]
(2012)International Conference on Biomedical Engineering 2012
Jackson, Nathan and Verbrugghe, Peter and Embrechts, Anika and Herijgers, Paul and Mendes, Eduardo and Stam, Frank (2012) Reliability testing of Implantable Polyacrylamide Electroactive Hydrogels International Conference on Biomedical Engineering 2012 Innsbruck, Austria, [Details]
(2011)Biofuture Conference 2011
Verbrugghe, Peter and Jackson, Nathan and Embrechts, Anika and Meuris, Bart and Stam, Frank and Mendes, Eduardo and Herijgers, Paul (2011) Swelling properties of polyacrylamide hydrogel for biomedical applications Biofuture Conference 2011 Ghent, Belgium, [Details]
(2011)IEEE International Reliability Physics Symposium (IRPS 2011)
Jesudoss, P; Mathewson, A; Wright, WMD; Twomey, K; Stam, F; (2011) A swallowable diagnostic capsule with a direct access sensor using anisotropic conductive adhesive IEEE International Reliability Physics Symposium (IRPS 2011) Monterey, CA, , 20-APR-11 - 14-APR-11 , pp.1-4 [Details]
(2010)2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
Jesudoss, P;Chen, WB;Mathewson, A;Wright, WMD;McCarthy, KG;Stam, F (2010) Electrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) , pp.369-374 [Details]
(2010)Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Hilt, Thierry; Boutry, Herve;Franiatte, Remi;Rothan, Frederic;Sillon, Nicolas;Stam, Frank;Mathewson, Alan;Wang, Ningning;O'Mathuna, Cian;Rodgers, Kenneth; (2010) DC/DC converter 3D assembly for autonomous sensor nodes Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th Las Vegas, NV, USA, , 01-JUN-10 - 04-JUN-10 , pp.834-839 [DOI] [CORA Link] [Details]
(2010)Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Jesudoss, Pio and Chen, Wenbin and Mathewson, Alan and Wright, William MD and McCarthy, Kevin G and Stam, Frank (2010) Electrical characterization of anisotropic conductive adhesive based flip chip for a direct access sensor Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th , pp.369-374 [Details]
(2010)IMAPS International Conference on Device Packaging
Ramm, Peter and Lietaer, Nicolas and De Raedt, Walter and Fritsch, Thomas and Hilt, Thierry and Couderc, Pascal and Val, Christian and Mathewson, Alan and Razeeb, Kafil M and Stam, Frank and others (2010) The European 3D technology platform (e-CUBES) IMAPS International Conference on Device Packaging , pp.4-11 [Details]
(2009)Microelectronics and Packaging Conference, 2009. EMPC 2009. European
Jesudoss, Pio and Mathewson, Alan and Wright, William and McCaffrey, Colm and Ogurtsov, Vladimir and Twomey, Karen and Stam, Frank (2009) System packaging \& integration for a swallowable capsule using a direct access sensor Microelectronics and Packaging Conference, 2009. EMPC 2009. European , pp.1-4 [CORA Link] [Details]
(2009)Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Stam, F and Razeeb, KM and Salwa, S and Mathewson, A (2009) Micro-nano interconnect between gold bond pads and copper nano-wires embedded in a polymer template Electronic Components and Technology Conference, 2009. ECTC 2009. 59th , pp.1470-1474 [Details]
(2009)2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2
Jesudoss, P;Mathewson, A;Wright, W;McCaffrey, C;Ogurtsov, V;Twomey, K;Stam, F (2009) System packaging & integration for a swallowable capsule using a direct access sensor 2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2 , pp.759-762 [Details]
(2008)Proc. XXXII International Microelectronics and Packaging IMAPS-IEEE CPMT Poland Conference (IMAPS-CPMT 2008)
Jesudoss, P. Mathewson, A; Wright, W; O'Flynn, B; Stam, F; (2008) Effect of Solder Volume on joint shape with variable chip-to-board contact pad ratio Proc. XXXII International Microelectronics and Packaging IMAPS-IEEE CPMT Poland Conference (IMAPS-CPMT 2008) , 21-SEP-08 - 24-SEP-08 [Details]
(2008)26th International Conference on Microelectronics (MIEL 2008)
Jesudoss, P; Mathewson, A; Wright, W; Stam, F; (2008) Evaluation of chip-to-board interconnection using variable aspect ratio contact pad areas . In: MIEL eds. 26th International Conference on Microelectronics (MIEL 2008) Nis, Serbia, , 11-MAY-08 - 14-MAY-08 , pp.565-568 [Details]
(2008)2008 26TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS
Jesudoss, P;Mathewson, A;Wright, W;Stam, F (2008) Evaluation of chip-to-board interconnection using variable aspect ratio contact pad areas 2008 26TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, VOLS 1 AND 2, PROCEEDINGS , pp.565-568 [Details]
(2004)SENSORS AND ACTUATORS B-CHEMICAL
Barsony, I;Furjes, P;Adam, M;Ducso, C;Vizvary, Z;Zettner, J;Stam, F (2004) Thermal response of microfilament heaters in gas sensing SENSORS AND ACTUATORS B-CHEMICAL , pp.442-447 [DOI] [Details]
(2003)SENSORS AND ACTUATORS B-CHEMICAL
Norman, A;Stam, F;Morrissey, A;Hirschfelder, M;Enderlein, D (2003) Packaging effects of a novel explosion-proof gas sensor SENSORS AND ACTUATORS B-CHEMICAL , pp.287-290 [DOI] [Details]
(2003)Sensors, 2003. Proceedings of IEEE
Norman, Aaron and Stam, Frank and Ducso, C (2003) Reliability of micromachined catalytic gas sensors Sensors, 2003. Proceedings of IEEE , pp.1310-1313 [Details]
(2000)Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on
Vuorela, M and Holloway, M and Fuchs, S and Stam, F and Kivilahti, J (2000) Bismuth-filled anisotropically conductive adhesive for flip chip bonding Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on , pp.147-152 [Details]
(1999)Proceedings of the 1999 International Symposium on Microelectronics
Stam, FA and Davitt, E and Barrett, J (1999) Reliability testing of SnAgCu solder surface mount assembly Proceedings of the 1999 International Symposium on Microelectronics , pp.259-263 [Details]
(1998)Lasers and Electro-Optics Europe, 1998. 1998 CLEO/Europe. Conference on
Crean, GM and Paineau, S and Corbett, B and O'Connell, D and Rodgers, K and Stam, F and Kelly, PV and Redmond, G (1998) Hybridisation Issues for Optoelectronic Components Lasers and Electro-Optics Europe, 1998. 1998 CLEO/Europe. Conference on , pp.50-50 [Details]
(1991)Factory Automation and Information Management - FAIM 1991
Stam, Frank A and Ahmad, M Munir (1991) PRELIMINARY STUDY ON DEVELOPING AN EXPERT SYSTEM FOR TAPE AUTOMATED BONDING Factory Automation and Information Management - FAIM 1991 Limerick, , 13-MAR-91 - 15-MAR-91 [Details]

Technical Publication

 YearPublication
(2000)Low-stress hybridisation of emitters, detectors and driver circuitry on a silicon motherboard for optoelectronic interconnect architecture.
Corbett, B and Rodgers, K and Stam, FA and O’Connell, D and Kelly, PV and Crean, GM (2000) Low-stress hybridisation of emitters, detectors and driver circuitry on a silicon motherboard for optoelectronic interconnect architecture. Technical Publication [Details]
(1995)Characterisation and reliability study of anisotropic conductive adhesives for fine pitch package assembly.
Stam, F and O'Grady, P and Barrett, J (1995) Characterisation and reliability study of anisotropic conductive adhesives for fine pitch package assembly. Technical Publication [Details]

Professional Activities

Patents

 Patent NumberTitleGranted
US 20130245606Hydrogel based occlusion system 15-MAR-13
990550Sensor Receptacle on Board (SROB) packaging method 06-JAN-99
US 20110202152AApparatus, system and method employing acceleration data 18-AUG-11

Conference Contributions

 YearPublication
(1999)Proceedings of the 10th International Symposium on Olfaction and Electronic Nose ISOEN'03,
K.Twomey, A. Rau, K. Murphy, F. Stam, B.O'Connor, J.Alderman; (1999) 2003 A Ruggedised Electronic Tongue for use in Food Processing Industry. [N/A], Proceedings of the 10th International Symposium on Olfaction and Electronic Nose ISOEN'03, Riga, Latvia , 30-DEC-99 - 30-DEC-99. [Details]

Disclosures

 TitleInventorSubmitted
SENSOR ENHANCED INSTRUMENTATION FOR NASOGASTRIC TUBE POSITION CONFIRMATION Calvin Coffey, Frank Stam, Colum Dunne27-MAR-13

Employment

 EmployerPositionFrom / To
Tyndall National Institute Senior Research Scientist10-SEP-05 /
Digital Equipment Corporation Project Engineer01-SEP-88 / 01-SEP-92
National Microelectronics Research Centre Research Scientist10-SEP-92 / 10-SEP-05

Education

 YearInstitutionQualificationSubject
1989Twente University, The Netherlands MEngScMechanical Engineering
1986Twente University, The Netherlands BSCMechanical Engineering

Languages

 LanguageReadingWritingSpeaking
Dutch FluentFluentFluent
German FluentFunctionalFunctional
English FluentFluentFluent

Teaching Activities

Teaching Interests

Recent Postgraduates

 Graduation YearStudent NameInstitutionDegree TypeThesis Title
2017Cian Clarke NUI (UCC)Masters of Engineering ScienceDevelopment of novel liquid metal electronic interconnects
2015Pio Jesudoss NUI (UCC)PHDDevelopment and reliability of a direct access sensor using flip-chip-on-flex technology and anisotropic conductive adhesive
2007Siti Salwa Mat Isa UCCMEngScNovel 3D Submicron Interconnect
2004Nicolle Wilke NUI (UCC)PHDFabrication of microneedle arrays for drug delivery using wet etch technologies
2003Daniel O’Keeffe UCCMEngScDesign and fabrication of an on-chip potentiostat
2000Elaine Davitt UCCMEngScThe use of power cycling to compare the quality and reliability of Pb-free and Pb bearing surface mount solder joints
1996Roger Nagle UCCMEngScAdhesive based flip-chip assembly
1995Ken Hernan UCCMEngScElectroless and electroplating for flip-chip bonding
1994Laurence O’Rourke UCCMEngScThe integrated decoupling capacitor
1993James O’Reilly NUI (UCC)MEngScReliability and failure analysis of fine pitch IC package connection

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