Oriented growth of metal and semiconductor nanostructures within aligned mesoporous channels

Typeset version

 

TY  - JOUR
  - Petkov, N.,Platschek, B.,Morris, M. A.,Holmes, J. D.,Bein, T.
  - 2007
  - March
  - Chemistry of Materials
  - Oriented growth of metal and semiconductor nanostructures within aligned mesoporous channels
  - Validated
  - ()
  - 19
  - 6
  - 1376
  - 1381
  - In the present work, we show how different types of inclusion chemistry can be used to generate oriented, high-aspect-ratio metal and semiconductor nanowires in insulating silica host structures prepared within anodic alumina membranes (AAMs). The structural features of the Pluronic123-templated silica filaments in the AAMs with their intriguing columnar and circular arrangement of mesopores allow for the inclusion of a variety of aligned 1D nanostructures ranging from metallic (Pt, Au, and Pd) and semiconductor (Ge) to carbon nanotubes and filaments. The synthetic techniques include wet chemical impregnation and reduction in precalcined mesopores, impregnation of surfactant-containing mesopore systems, and mass transport via supercritical fluid deposition in surfactant-containing mesopores. Important issues such as the crystallinity and continuity of the encapsulated wires as a function of material and deposition technique have been discussed.
  - 0897-4756
  - ://000244854900026
DA  - 2007/03
ER  - 
@article{V16860767,
   = {Petkov,  N. and Platschek,  B. and Morris,  M. A. and Holmes,  J. D. and Bein,  T. },
   = {2007},
   = {March},
   = {Chemistry of Materials},
   = {Oriented growth of metal and semiconductor nanostructures within aligned mesoporous channels},
   = {Validated},
   = {()},
   = {19},
   = {6},
  pages = {1376--1381},
   = {{In the present work, we show how different types of inclusion chemistry can be used to generate oriented, high-aspect-ratio metal and semiconductor nanowires in insulating silica host structures prepared within anodic alumina membranes (AAMs). The structural features of the Pluronic123-templated silica filaments in the AAMs with their intriguing columnar and circular arrangement of mesopores allow for the inclusion of a variety of aligned 1D nanostructures ranging from metallic (Pt, Au, and Pd) and semiconductor (Ge) to carbon nanotubes and filaments. The synthetic techniques include wet chemical impregnation and reduction in precalcined mesopores, impregnation of surfactant-containing mesopore systems, and mass transport via supercritical fluid deposition in surfactant-containing mesopores. Important issues such as the crystallinity and continuity of the encapsulated wires as a function of material and deposition technique have been discussed.}},
  issn = {0897-4756},
   = {://000244854900026},
  source = {IRIS}
}
AUTHORSPetkov, N.,Platschek, B.,Morris, M. A.,Holmes, J. D.,Bein, T.
YEAR2007
MONTHMarch
JOURNAL_CODEChemistry of Materials
TITLEOriented growth of metal and semiconductor nanostructures within aligned mesoporous channels
STATUSValidated
TIMES_CITED()
SEARCH_KEYWORD
VOLUME19
ISSUE6
START_PAGE1376
END_PAGE1381
ABSTRACTIn the present work, we show how different types of inclusion chemistry can be used to generate oriented, high-aspect-ratio metal and semiconductor nanowires in insulating silica host structures prepared within anodic alumina membranes (AAMs). The structural features of the Pluronic123-templated silica filaments in the AAMs with their intriguing columnar and circular arrangement of mesopores allow for the inclusion of a variety of aligned 1D nanostructures ranging from metallic (Pt, Au, and Pd) and semiconductor (Ge) to carbon nanotubes and filaments. The synthetic techniques include wet chemical impregnation and reduction in precalcined mesopores, impregnation of surfactant-containing mesopore systems, and mass transport via supercritical fluid deposition in surfactant-containing mesopores. Important issues such as the crystallinity and continuity of the encapsulated wires as a function of material and deposition technique have been discussed.
PUBLISHER_LOCATION
ISBN_ISSN0897-4756
EDITION
URL://000244854900026
DOI_LINK
FUNDING_BODY
GRANT_DETAILS