Doping controlled roughness and defined mesoporosity in chemically etched silicon nanowires with tunable conductivity

Typeset version

 

TY  - JOUR
  - McSweeney. W.; Lotty, O.; Mogili, V.; Glynn, C.; Geaney, H.; Tanner, D.; Holmes, J. D.; O’Dwyer, C.
  - 2013
  - July
  - Journal of Applied Physics
  - Doping controlled roughness and defined mesoporosity in chemically etched silicon nanowires with tunable conductivity
  - Published
  - ()
  - 114
  - na
  - 034309-1
  - 034309-11
  - By using Si(100) with different dopant type (n++-type (As) or p-type (B)), we show how metal-assisted chemically etched (MACE) nanowires (NWs) can form with rough outer surfaces around a solid NW core for p-type NWs, and a unique, defined mesoporous structure for highly doped n-type NWs. We used high resolution electron microscopy techniques to define the characteristic roughening and mesoporous structure within the NWs and how such structures can form due to a judicious choice of carrier concentration and dopant type. The n-type NWs have a mesoporosity that is defined by equidistant pores in all directions, and the inter-pore distance is correlated to the effective depletion region width at the reduction potential of the catalyst at the silicon surface in a HF electrolyte. Clumping in n-type MACE Si NWs is also shown to be characteristic of mesoporous NWs when etched as high density NW layers, due to low rigidity (high porosity). Electrical transport investigations show that the etched nanowires exhibit tunable conductance changes, where the largest resistance increase is found for highly mesoporous n-type Si NWs, in spite of their very high electronic carrier concentration. This understanding can be adapted to any low-dimensional semiconducting system capable of selective etching through electroless, and possibly electrochemical, means. The process points to a method of multiscale nanostructuring NWs, from surface roughening of NWs with controllable lengths to defined mesoporosity formation, and may be applicable to applications where high surface area, electrical connectivity, tunable surface structure, and internal porosity are required.
  - USA
  - na
  - na
  - http://jap.aip.org/
  - http://dx.doi.org/10.1063/1.4813867
DA  - 2013/07
ER  - 
@article{V221344580,
   = {McSweeney. W. and  Lotty, O. and  Mogili, V. and  Glynn, C. and  Geaney, H. and  Tanner, D. and  Holmes, J. D. and  O’Dwyer, C.},
   = {2013},
   = {July},
   = {Journal of Applied Physics},
   = {Doping controlled roughness and defined mesoporosity in chemically etched silicon nanowires with tunable conductivity},
   = {Published},
   = {()},
   = {114},
   = {na},
  pages = {034309-1--034309-11},
   = {{By using Si(100) with different dopant type (n++-type (As) or p-type (B)), we show how metal-assisted chemically etched (MACE) nanowires (NWs) can form with rough outer surfaces around a solid NW core for p-type NWs, and a unique, defined mesoporous structure for highly doped n-type NWs. We used high resolution electron microscopy techniques to define the characteristic roughening and mesoporous structure within the NWs and how such structures can form due to a judicious choice of carrier concentration and dopant type. The n-type NWs have a mesoporosity that is defined by equidistant pores in all directions, and the inter-pore distance is correlated to the effective depletion region width at the reduction potential of the catalyst at the silicon surface in a HF electrolyte. Clumping in n-type MACE Si NWs is also shown to be characteristic of mesoporous NWs when etched as high density NW layers, due to low rigidity (high porosity). Electrical transport investigations show that the etched nanowires exhibit tunable conductance changes, where the largest resistance increase is found for highly mesoporous n-type Si NWs, in spite of their very high electronic carrier concentration. This understanding can be adapted to any low-dimensional semiconducting system capable of selective etching through electroless, and possibly electrochemical, means. The process points to a method of multiscale nanostructuring NWs, from surface roughening of NWs with controllable lengths to defined mesoporosity formation, and may be applicable to applications where high surface area, electrical connectivity, tunable surface structure, and internal porosity are required.}},
   = {USA},
  issn = {na},
   = {na},
   = {http://jap.aip.org/},
   = {http://dx.doi.org/10.1063/1.4813867},
  source = {IRIS}
}
AUTHORSMcSweeney. W.; Lotty, O.; Mogili, V.; Glynn, C.; Geaney, H.; Tanner, D.; Holmes, J. D.; O’Dwyer, C.
YEAR2013
MONTHJuly
JOURNAL_CODEJournal of Applied Physics
TITLEDoping controlled roughness and defined mesoporosity in chemically etched silicon nanowires with tunable conductivity
STATUSPublished
TIMES_CITED()
SEARCH_KEYWORD
VOLUME114
ISSUEna
START_PAGE034309-1
END_PAGE034309-11
ABSTRACTBy using Si(100) with different dopant type (n++-type (As) or p-type (B)), we show how metal-assisted chemically etched (MACE) nanowires (NWs) can form with rough outer surfaces around a solid NW core for p-type NWs, and a unique, defined mesoporous structure for highly doped n-type NWs. We used high resolution electron microscopy techniques to define the characteristic roughening and mesoporous structure within the NWs and how such structures can form due to a judicious choice of carrier concentration and dopant type. The n-type NWs have a mesoporosity that is defined by equidistant pores in all directions, and the inter-pore distance is correlated to the effective depletion region width at the reduction potential of the catalyst at the silicon surface in a HF electrolyte. Clumping in n-type MACE Si NWs is also shown to be characteristic of mesoporous NWs when etched as high density NW layers, due to low rigidity (high porosity). Electrical transport investigations show that the etched nanowires exhibit tunable conductance changes, where the largest resistance increase is found for highly mesoporous n-type Si NWs, in spite of their very high electronic carrier concentration. This understanding can be adapted to any low-dimensional semiconducting system capable of selective etching through electroless, and possibly electrochemical, means. The process points to a method of multiscale nanostructuring NWs, from surface roughening of NWs with controllable lengths to defined mesoporosity formation, and may be applicable to applications where high surface area, electrical connectivity, tunable surface structure, and internal porosity are required.
PUBLISHER_LOCATIONUSA
ISBN_ISSNna
EDITIONna
URLhttp://jap.aip.org/
DOI_LINKhttp://dx.doi.org/10.1063/1.4813867
FUNDING_BODY
GRANT_DETAILS