Electrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor

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TY  - CONF
  - Jesudoss, P; Chen, W; Mathewson, A; Wright, WMD; McCarthy, KG; Stam, F
  - IEEE Electronic Components and Technology Conference
  - Electrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor
  - 2010
  - June
  - Validated
  - 1
  - ()
  - 369
  - 374
  - Las Vegas
  - 01-JUN-10
  - 06-JUN-10
DA  - 2010/06
ER  - 
@inproceedings{V68097258,
   = {Jesudoss, P and  Chen, W and  Mathewson, A and  Wright, WMD and  McCarthy, KG and  Stam, F},
   = {IEEE Electronic Components and Technology Conference},
   = {{Electrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor}},
   = {2010},
   = {June},
   = {Validated},
   = {1},
   = {()},
  pages = {369--374},
   = {Las Vegas},
  month = {Jun},
   = {06-JUN-10},
  source = {IRIS}
}
AUTHORSJesudoss, P; Chen, W; Mathewson, A; Wright, WMD; McCarthy, KG; Stam, F
TITLEIEEE Electronic Components and Technology Conference
PUBLICATION_NAMEElectrical Characterization of Anisotropic Conductive Adhesive Based Flip Chip for a Direct Access Sensor
YEAR2010
MONTHJune
STATUSValidated
PEER_REVIEW1
TIMES_CITED()
SEARCH_KEYWORD
EDITORS
START_PAGE369
END_PAGE374
LOCATIONLas Vegas
START_DATE01-JUN-10
END_DATE06-JUN-10
ABSTRACT
FUNDED_BY
URL
DOI_LINK
FUNDING_BODY
GRANT_DETAILS