Minimization of Via Count In Multiple-Metal Inductors: Performance Characterization and Physical Modelling

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TY  - 
  - Other
  - Murphy, OH, McCarthy, KG, Murphy, PJ
  - 2006
  - June
  - Minimization of Via Count In Multiple-Metal Inductors: Performance Characterization and Physical Modelling
  - Validated
  - 1
  - ()
  - High Q on-chip inductors are vital for modern RF ICs. A proven method of Q-enhancement is to use multiple metals stacked in a shunt manner, with a dense array of vias. The impact of fewer vias has not been investigated before. Here, we show that the same Q can be achieved with significantly fewer vias, thus simplifying the inductor layout. The traditional and new approaches are explained and physical models developed which give excellent agreement between simulations and measurements up to 6GHz..
  - 490
  - 493
DA  - 2006/06
ER  - 
@misc{V725356,
   = {Other},
   = {Murphy,  OH and  McCarthy,  KG and  Murphy,  PJ },
   = {2006},
   = {June},
   = {Minimization of Via Count In Multiple-Metal Inductors: Performance Characterization and Physical Modelling},
   = {Validated},
   = {1},
   = {()},
   = {{High Q on-chip inductors are vital for modern RF ICs. A proven method of Q-enhancement is to use multiple metals stacked in a shunt manner, with a dense array of vias. The impact of fewer vias has not been investigated before. Here, we show that the same Q can be achieved with significantly fewer vias, thus simplifying the inductor layout. The traditional and new approaches are explained and physical models developed which give excellent agreement between simulations and measurements up to 6GHz..}},
  pages = {490--493},
  source = {IRIS}
}
OTHER_PUB_TYPEOther
AUTHORSMurphy, OH, McCarthy, KG, Murphy, PJ
YEAR2006
MONTHJune
TITLEMinimization of Via Count In Multiple-Metal Inductors: Performance Characterization and Physical Modelling
RESEARCHER_ROLE
STATUSValidated
PEER_REVIEW1
TIMES_CITED()
SEARCH_KEYWORD
REFERENCE
ABSTRACTHigh Q on-chip inductors are vital for modern RF ICs. A proven method of Q-enhancement is to use multiple metals stacked in a shunt manner, with a dense array of vias. The impact of fewer vias has not been investigated before. Here, we show that the same Q can be achieved with significantly fewer vias, thus simplifying the inductor layout. The traditional and new approaches are explained and physical models developed which give excellent agreement between simulations and measurements up to 6GHz..
PUBLISHER_LOCATION
PUBLISHER
EDITORS
ISBN_ISSN
EDITION
URL
START_PAGE490
END_PAGE493
DOI_LINK
FUNDING_BODY
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