SAMSUNG ELECTRONICS CO., LTD.'s US Patent application for "SEMICONDUCTOR PACKAGE" is in published phase now

Press/Media

Period13 Jan 2024

Media coverage

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Media coverage

  • TitleSAMSUNG ELECTRONICS CO., LTD.'s US Patent application for "SEMICONDUCTOR PACKAGE" is in published phase now
    Media name/outletImpact Financial News
    Country/TerritoryUnited Kingdom
    Date13/01/24
    PersonsJun Su Lee
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