Tyndall’s Photonics Packaging Group partners with MIT on chip development...

Press/Media

Period	1 May 2024

Media coverage

Title	Tyndall’s Photonics Packaging Group partners with MIT on chip development...
Media name/outlet	OPTICS.ORG
Country/Territory	United Kingdom
Date	1/05/24
URL	https://optics.org/news/15/5/2
Persons	Peter O'Brien, Brian Corbett