Research output per year
Research output per year
Personal profile
Biography
Dr. Kamil Gradkowski is a Senior Researcher in the Photonics Packaging Group at the Tyndall National Institute.
Research Interests
Pluggable Photonic Packaging
Research Grants
As a PI:
- QPIC 1550: EU Horizon Europe Research and Innovation Programme under Grant Agreement No 101135785 (2023-2027).
- PIONEAR: EU Horizon Europe Research and Innovation Programme under Grant Agreement No 101129931. (2024-2028).
Fingerprint
Dive into the research topics where Kamil Gradkowski is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Chip-agnostic optical packaging of photonic integrated circuits using refractive micro-optics
Gradkowski, K. & O’Brien, P., 10 May 2025, In: Applied Optics. 64, 14, p. 4014-4022 9 p.Research output: Contribution to journal › Article › peer-review
Open Access -
Exploring Heterogeneous Integration of Thick Micro-Lens Array for Pluggable Photonics Packaging
Wakeel, S., Morrissey, P. E., Gradkowski, K., Hwang, H. Y., Atar, F. B., Genc, M., Ramaswamy, P., Corbett, B. & O’Brien, P., 2025, Proceedings Volume 13362, Optical Components and Materials XXII; 1336211 (2025).Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review
-
Innovations in fibre array coupling and integration for high-bandwidth FPGA multichip packages
Hall, M. L., He, X., Chiu, C. P., Morrissey, P. E., Gradkowski, K., Jayaram, V., Cheng, F., Hoang, T. T., Bergman, K., O’Brien, P. & Hosseini, K., 2025, Optical Interconnects and Packaging 2025. Chen, R. T. & Schroder, H. (eds.). SPIE, 1337204. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 13372).Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review
-
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits
Gradkowski, K., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 6, p. 1156-1160 5 p.Research output: Contribution to journal › Article › peer-review
Open Access -
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays
Gradkowski, K. & O'Brien, P., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 8, p. 1601-1605 5 p.Research output: Contribution to journal › Article › peer-review
Open Access
Press/Media
-
Research Bits: Jan. 16
He, X., O'Brien, P., Gradkowski, K., Razeeb Mahmood, K. & Morrissey, P.
16/01/24
1 item of Media coverage
Press/Media