@inproceedings{d9225422b1b14dd3a0d6e7cb8743d3f0,
title = "128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array",
abstract = "We design and fabricate the packaging of 128 × 128 silicon photonic MEMS switch device using through glass via (TGV) interposer and pitch reducing fibre array. The switch device contains 16384 MEMS switch cells and 272 grating couplers spaced at 63.5 μm in a compact footprint of 17.4 mm × 16 mm. The apodised grating couplers designed for 1300 nm have an insertion loss of 2.5 dB/facet at 10° coupling angle. The 0.5 mm thick glass interposer contains 512 electrical vias while the pitch reducing optical coupling array is polished to 40° for planar coupling.",
author = "Hwang, \{How Yuan\} and Padraic Morrissey and Lee, \{Jun Su\} and Peter O'Brien and Johannes Henriksson and Wu, \{Ming C.\} and Seok, \{Tae Joon\}",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 ; Conference date: 06-12-2017 Through 09-12-2017",
year = "2017",
month = jul,
day = "2",
doi = "10.1109/EPTC.2017.8277436",
language = "English",
series = "2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--4",
booktitle = "2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017",
address = "United States",
}