@inproceedings{ed2557d64a41465e87f4eee1301fac4f,
title = "25Gb/s Error-free transmission with a packaged chipset integrating a III-V/SOI DFB laser an electro-absorption modulator and a semiconductor optical amplifier",
abstract = "We report on the first hybrid III-V on silicon integration of a DFB laser, an electro-absorption modulator and a semiconductor optical amplifier. We packaged the fabricated chipset and validated the module through 25Gb/s error-free transmissions for short reach communication applications.",
author = "Ines Ghorbel and Antonin Gallet and Alexandre Shen and David Carrara and Dalila Make and Guillaume Levaufre and Duan, \{Guang Hua\} and Segolene Olivier and Christophe Jany and Stephane Malhouitre and Christophe Kopp and Cormac Eason and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 14th International Conference on Group IV Photonics, GFP 2017 ; Conference date: 23-08-2017 Through 25-08-2017",
year = "2017",
month = oct,
day = "24",
doi = "10.1109/GROUP4.2017.8082215",
language = "English",
series = "14th International Conference on Group IV Photonics, GFP 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "99--100",
booktitle = "14th International Conference on Group IV Photonics, GFP 2017",
address = "United States",
}