3-D microsensor modules for future intelligent environments

Major research efforts are currently targeting the " disappearance" of the computer into the fabric of our environment. In the future, the spaces in which we live will be populated by many thousands of objects with the ability to sense and actuate in their environment, to perform localised computation and to communicate, even collaborate, with each other. The Intelligent Seed programme is about creating appropriate functional architectural templates for enabling future intelligent environments, and providing appropriate levels of miniaturisation that solve future production and usability issues. The primary hardware re-search target that connects these goals is a requirement to develop very highly miniaturised wireless micro-sensor networks of the order of 1mm³. This program is guided by a roadmap that incorporates the development of 25mm, 10mm, 5mm, and 1mm cubic modules, each undergoing development and evaluation through selected experimental scenarios.. The larger 25mm and 10mm cubic formats provide the scope for the rapid-prototype assembly of autonomous transducer systems. The highly miniaturised form factors, 5mm and 1mm, utilize the numerous high-density integration techniques that are the subject of current state-of-the-art research worldwide. In particular, these include multichip modules (MCM), 3-D integration, system-on-chip (SoC), and system-in-a-package (SiP) technology development. Material systems and processes are also being adapted to encompass the changing requirements for very highly integrated autonomous systems. These include the development of very thin flexible multi-layer substrates, the integration of thin silicon ICs (each at 50 mm or less), and the development of novel substrates and new approaches to solve handling and assembly issues for Intelligent Seed modules.