3D packaging of a microfluidic system with sensory applications

Engineering

• Microsystem 100%
• Sensor Chip 66%
• Induced Stress 66%
• Limitations 33%
• Power Supply 33%
• Cost Reduction 33%
• Sensor Device 33%
• Active Area 33%
• Thermal Sensor 33%
• Field-Effect Transistor 33%
• Pressure Sensor 33%
• Chemical Sensor 33%
• Microsensor 33%
• Multichip Modules 33%
• Micropump 33%
• Silicon Sensor 33%
• Optical Fiber 33%

Material Science

• Silicon 100%
• Density 33%
• Field Effect Transistor 33%
• Chemical Sensor 33%
• Thermal Sensor 33%
• Glass Fiber 33%
• Microsensor 33%