3D packaging of a microsystem with special thermal constraints

A. Morrissey; J. Alderman; G. Kelly; Z. Kohari; A. Pahi; M. Rencz

3D packaging of a microsystem with special thermal constraints

A. Morrissey
, J. Alderman
, G. Kelly
, Z. Kohari
, A. Pahi
, M. Rencz

Office of the Vice President for Research and Innovation

University College Cork

Research output: Contribution to conference › Paper › peer-review

Abstract

After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

Original language	English
Pages	171-174
Number of pages	4
Publication status	Published - 1998
Event	Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures - Cannes, Fr Duration: 27 Sep 1998 → 29 Sep 1998

Conference

Conference	Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures
City	Cannes, Fr
Period	27/09/98 → 29/09/98

Cite this

@conference{c946b371f3154cc3b937c429252a401b,

title = "3D packaging of a microsystem with special thermal constraints",

abstract = "After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.",

author = "A. Morrissey and J. Alderman and G. Kelly and Z. Kohari and A. Pahi and M. Rencz",

year = "1998",

language = "English",

pages = "171--174",

note = "Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures ; Conference date: 27-09-1998 Through 29-09-1998",

}

TY - CONF

T1 - 3D packaging of a microsystem with special thermal constraints

AU - Morrissey, A.

AU - Alderman, J.

AU - Kelly, G.

AU - Kohari, Z.

AU - Pahi, A.

AU - Rencz, M.

PY - 1998

Y1 - 1998

N2 - After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

AB - After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.

UR - https://www.scopus.com/pages/publications/0032294358

M3 - Paper

AN - SCOPUS:0032294358

SP - 171

EP - 174

T2 - Proceedings of the 1998 4th International Workshop on Thermal Investigations of ICs Microstructures

Y2 - 27 September 1998 through 29 September 1998

ER -

3D packaging of a microsystem with special thermal constraints

Abstract

Conference

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