Abstract
A novel microsystem incorporating a micromachined silicon membrane pump, packaged in a 3D MCM-V package is described. Finite element techniques are used to analyze the encapsulation stress in the assembled structure and the silicon membrane. The design of the silicon chip carrier substrates is improved by modifying the design of the cutting windows to reduce the risk of cracking. A combination of numerical and analytical techniques are used to deduce limits for the maximum permissible dimensions of the membrane to minimize the risk of buckling due to residual compressive stresses.
| Original language | English |
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| Pages (from-to) | 1227-1234 |
| Number of pages | 8 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Publication status | Published - 1997 |
| Event | Proceedings of the 1997 47th IEEE Electronic Components & Technology Conference - San Jose, CA, USA Duration: 18 May 1997 → 21 May 1997 |