TY - JOUR
T1 - A 3D miniaturised programmable transceiver
AU - O'Flynn, Brendan
AU - Bellis, S.
AU - Mahmood, K.
AU - Morris, M.
AU - Duffy, G.
AU - Delaney, K.
AU - O'Mathuna, C.
PY - 2005
Y1 - 2005
N2 - Purpose - To describe the development of a three dimensional programmable transceiver system of modular design for use as a development tool for a variety of wireless sensor node applications. Design/methodology/approach - As a stepping-stone towards the development of wireless nodes, sensor networks programme was put in place to develop a 25 mm cube module, which was modular in construction, programmable and miniaturised in form factor. This was to facilitate the development of wireless sensor networks for a variety of different applications. The nodes are used as a platform for sensing and actuating through various parameters, for use in scalable, reconfigurable distributed autonomous sensing networks in a number of research projects currently underway in the Tyndall Institute, as well as other institutes and in a variety of research programs in the area of wireless sensor networks. Findings - The modular construction enables the heterogeneous implementation of a variety of technologies required in the arena of wireless sensor networks: Intelligence, numerical processing, memory, sensors, power supply and conditioning, all in a similar form factor. This enables rapid deployment of different sensor network nodes in an application specific fashion. Research limitations/implications - Characterisation of the transceiver module is ongoing, particularly in the field of the wireless communication platform utilized, and its capabilities. Practical implications - A rapid prototyping and development cycle of application specific wireless sensor networks has been enabled by the development of this modular system. Originality/value - This paper provides information about the development work and some potential application areas made available by the implementation of a miniaturised modular wireless sensor node for use in a variety of application scenarios.
AB - Purpose - To describe the development of a three dimensional programmable transceiver system of modular design for use as a development tool for a variety of wireless sensor node applications. Design/methodology/approach - As a stepping-stone towards the development of wireless nodes, sensor networks programme was put in place to develop a 25 mm cube module, which was modular in construction, programmable and miniaturised in form factor. This was to facilitate the development of wireless sensor networks for a variety of different applications. The nodes are used as a platform for sensing and actuating through various parameters, for use in scalable, reconfigurable distributed autonomous sensing networks in a number of research projects currently underway in the Tyndall Institute, as well as other institutes and in a variety of research programs in the area of wireless sensor networks. Findings - The modular construction enables the heterogeneous implementation of a variety of technologies required in the arena of wireless sensor networks: Intelligence, numerical processing, memory, sensors, power supply and conditioning, all in a similar form factor. This enables rapid deployment of different sensor network nodes in an application specific fashion. Research limitations/implications - Characterisation of the transceiver module is ongoing, particularly in the field of the wireless communication platform utilized, and its capabilities. Practical implications - A rapid prototyping and development cycle of application specific wireless sensor networks has been enabled by the development of this modular system. Originality/value - This paper provides information about the development work and some potential application areas made available by the implementation of a miniaturised modular wireless sensor node for use in a variety of application scenarios.
KW - Electric power transmission
KW - Sensors
KW - Transceivers
UR - https://www.scopus.com/pages/publications/18144399296
U2 - 10.1108/13565360510592162
DO - 10.1108/13565360510592162
M3 - Article
AN - SCOPUS:18144399296
SN - 1356-5362
VL - 22
SP - 8
EP - 12
JO - Microelectronics International
JF - Microelectronics International
IS - 2
ER -