A comparative analysis of interconnection technologies for integrated multilayer inductors

Stephen O'Reilly; John Flannery; Terence O'Donnell; Andrew Muddiman; Gerard Healy; Michael Byrne; Sean Cian Ó Mathúna; Maeve Duffy; Ger Hurley

doi:10.1108/13565369810199059

A comparative analysis of interconnection technologies for integrated multilayer inductors

Stephen O'Reilly
, John Flannery
, Terence O'Donnell
, Andrew Muddiman
, Gerard Healy
, Michael Byrne
, Sean Cian Ó Mathúna
, Maeve Duffy
, Ger Hurley

Tyndall IPES (Integrated Power)

Research output: Contribution to journal › Article › peer-review

Abstract

Multilayer air-core inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick-film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine-line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self-resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.

Original language	English
Pages (from-to)	6-10
Number of pages	5
Journal	Microelectronics International
Volume	15
Issue number	1
DOIs	https://doi.org/10.1108/13565369810199059
Publication status	Published - Jan 1998

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abstract = "Multilayer air-core inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick-film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine-line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self-resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.",

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AU - Muddiman, Andrew

AU - Healy, Gerard

AU - Byrne, Michael

AU - Ó Mathúna, Sean Cian

AU - Duffy, Maeve

AU - Hurley, Ger

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N2 - Multilayer air-core inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick-film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine-line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self-resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.

AB - Multilayer air-core inductors fabricated in a range of interconnection technologies which are MCM compatible are presented and compared. These consist of thick-film, low temperature cofired ceramic (LTCC), printed circuit board (PCB) and fine-line plated copper on ceramic (copper plating). From a comparison of simulated and measured results, it can be concluded that a predictive design capability has been achieved for inductance and self-resonant frequency (SRF). Modelling of AC resistance and Q requires further investigation.

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A comparative analysis of interconnection technologies for integrated multilayer inductors

Abstract

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