@inbook{0890fc2e0f6b4262968f67b7e26904dd,
title = "A LED micro-display with 90×90 pixels on a 80 μm pitch",
abstract = "We report on the flip-chip packaging of 90×90 arrays of addressable microLEDs onto CMOS circuitry by a solder reflow process. The substrate emitting microLEDs were parabolically shaped and fabricated on free-standing GaN. The individual emitters were 15 μm in diameter with an array pitch of 80 μm where all bond pads were given a gold finish. The solder balls were dispensed onto the CMOS pads with an automated PacTech solder dispenser that dispensed 50 μm diameter solder spheres with a composition of Sn (96.5\%)-Ag-(3\%)-Cu (0.5\%). After alignment of the LED array on top of the CMOS chip, the solder was reflowed at a temperature of 260 C in nitrogen ambient. The completed assemblies form micro-displays that can display computer generated patterns designed for the stimulation of neural cells. The displays were designed to be mounted on the camera port of a microscope to project the emitted light onto neural tissue.",
author = "Mahbub Akhter and Lee, \{Jun Su\} and Maaskant, \{Pleun P.\} and Marc Rensing and Noreen Nudds and Peter O'Brien and Patrick Degenaar and Brian Corbett",
note = "Publisher Copyright: {\textcopyright} 2015 IMAPS Europe.; 20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015 ; Conference date: 14-09-2015 Through 16-09-2015",
year = "2016",
month = jan,
day = "25",
language = "English",
series = "20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "20th European Microelectronics and Packaging Conference and Exhibition",
address = "United States",
}