TY - GEN
T1 - A swallowable diagnostic capsule with a direct access sensor using Anisotropic Conductive Adhesive
AU - Jesudoss, Pio
AU - Mathewson, Alan
AU - Twomey, Karen
AU - Stam, Frank
AU - Wright, William M.D.
PY - 2011
Y1 - 2011
N2 - Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic sensing capsules are an example of this. In this paper, a novel direct access sensor (DAS) has been demonstrated which uses Flip Chip (FC) technology to expose the sensor to the liquid medium. An electrochemical study showed that the Anisotropic Conductive Adhesive (ACA) joint provides good connection and does not impair the sensor functionality. The reliability test results showed that most of the samples survived the humidity aging test and that only 2 out of 9 ACA connections of the same electrode failed. For the failed samples, the failure analysis showed that the tensile stress at the chip/epoxy interface caused a delamination at this interface.
AB - Technological developments in biomedical microsystems are opening up new opportunities to improve healthcare procedures. Swallowable diagnostic sensing capsules are an example of this. In this paper, a novel direct access sensor (DAS) has been demonstrated which uses Flip Chip (FC) technology to expose the sensor to the liquid medium. An electrochemical study showed that the Anisotropic Conductive Adhesive (ACA) joint provides good connection and does not impair the sensor functionality. The reliability test results showed that most of the samples survived the humidity aging test and that only 2 out of 9 ACA connections of the same electrode failed. For the failed samples, the failure analysis showed that the tensile stress at the chip/epoxy interface caused a delamination at this interface.
KW - Anisotropic conuctive ahesive (ACA)
KW - Direct Access Sensor (DAS)
KW - Flip hip Over Hole (FCOH)
KW - reliability
KW - swallowable diagnostic sensing capsule
UR - https://www.scopus.com/pages/publications/79959322331
U2 - 10.1109/IRPS.2011.5784481
DO - 10.1109/IRPS.2011.5784481
M3 - Conference proceeding
AN - SCOPUS:79959322331
SN - 9781424491117
T3 - IEEE International Reliability Physics Symposium Proceedings
SP - 3B.3.1-3B.3.7
BT - 2011 International Reliability Physics Symposium, IRPS 2011
T2 - 49th International Reliability Physics Symposium, IRPS 2011
Y2 - 10 April 2011 through 14 April 2011
ER -