Additive influence on Cu nanotube electrodeposition in anodised aluminium oxide templates

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Abstract

Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl-) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40-70 nm) is significantly influenced by the action of the additives. In the presence of either Cl- or SPS solid wire growth is observed, however, when PEG is added with Cl- the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl- and PEG restores the growth of wires.

Original languageEnglish
Pages (from-to)1203-1206
Number of pages4
JournalElectrochemistry Communications
Volume11
Issue number6
DOIs
Publication statusPublished - Jun 2009

Keywords

  • AAO
  • Additives
  • Copper
  • Electrodeposition
  • Nanotubes
  • Templates

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