Abstract
Anodised aluminium oxide (AAO) templates have been utilised to investigate Cu deposition from a typical sulphate plating bath. The influence of the common additives poly ethylene glycol (PEG), chloride ion (Cl-) and Bis-(sodium sulphopropyl)-disulphide (SPS) on the deposition process has been analysed. The growth of Cu wires or nanotubes (with tube walls of 40-70 nm) is significantly influenced by the action of the additives. In the presence of either Cl- or SPS solid wire growth is observed, however, when PEG is added with Cl- the growth of ordered Cu nanotubes is observed. SPS added to a bath containing Cl- and PEG restores the growth of wires.
| Original language | English |
|---|---|
| Pages (from-to) | 1203-1206 |
| Number of pages | 4 |
| Journal | Electrochemistry Communications |
| Volume | 11 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - Jun 2009 |
Keywords
- AAO
- Additives
- Copper
- Electrodeposition
- Nanotubes
- Templates