@inbook{51cf7d17bac943c887f0ef1373fd3e35,
title = "An Integrated Platform for Cavity Optomechanics with Vacuum-Sealed Silicon Photonic MEMS",
abstract = "Silicon photonics is an excellent platform for integrated cavity optomechanics due to silicon's high light confinement and favorable mechanical properties. However, optomechanical devices require a vacuum environment to inhibit damping due to air.We present an integrated platform for cavity optomechanics using thermo-compression bonding of silicon caps to provide on-chip vacuum sealing. We demonstrate optomechanical coupling in a vacuum-sealed ring resonator implemented on the platform, either by modulation of the laser power or by using an electrostatic phase shifter in the ring.By enabling optomechanics on a standard platform, we aim to make the technology available to a wider user base.",
keywords = "optomechanics, silicon photonic foundry, silicon photonic MEMS, Silicon photonics, vacuum-sealing",
author = "Pierre Edinger and Gaehun Jo and Bleiker, \{Simon J.\} and Takabayashi, \{Alain Y.\} and Niels Quack and Peter Verheyen and Umar Khan and Wim Bogaerts and Cleitus Antony and Frank Niklaus and Gylfason, \{Kristinn B.\}",
note = "Publisher Copyright: {\textcopyright} 2023 IEEJ.; 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 ; Conference date: 25-06-2023 Through 29-06-2023",
year = "2023",
language = "English",
series = "2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "425--428",
booktitle = "2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023",
address = "United States",
}