Abstract
Results are presented from an analysis of the electrically activity of defects at the Si(100)/HfO2 interface. Two clear peaks emerge in the interface state density profiles, at specific energies in the upper and lower energy gap, when the high K samples were deposited at sufficiently low temperatures to prevent hydrogen passivation of interface defects. The location of these peaks correspond to the location of Pb0 (/Pb1) defects in the Si(100)/SiO2 system. Defect densities are estimated to be of order mid 1012 cm-2 for HfO2 samples. This density is significantly higher than is the case in the Si(100)/SiO 2 system, and seems relatively independent of surface preparation steps performed. Performing a forming gas anneal at 450°C for 30 mins is not sufficient to fully passivate these interface defects, as is the case in the Si/SiO2 system.
| Original language | English |
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| Pages | 197-206 |
| Number of pages | 10 |
| Publication status | Published - 2003 |
| Event | Physics and Technology of High-k Gate Dielectric I - Proceedings of the International Symposium on High Dielectric Constant Materials: Materials Science, Processing Reliability, and Manufacturing Issues - Salt Lake City, UT, United States Duration: 20 Oct 2002 → 24 Oct 2002 |
Conference
| Conference | Physics and Technology of High-k Gate Dielectric I - Proceedings of the International Symposium on High Dielectric Constant Materials: Materials Science, Processing Reliability, and Manufacturing Issues |
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| Country/Territory | United States |
| City | Salt Lake City, UT |
| Period | 20/10/02 → 24/10/02 |