Analysis of electrically active defects at Si(100) - HfO2 interface

  • B. J. O'Sullivan
  • , E. O'Connor
  • , P. K. Hurley
  • , M. Modreanu
  • , F. Roussel
  • , H. Roussel
  • , M. A. Audier
  • , J. P. Sénateur
  • , Q. Fang
  • , I. W. Boyd
  • , C. Jimenez
  • , T. Leedham

Research output: Contribution to conferencePaperpeer-review

Abstract

Results are presented from an analysis of the electrically activity of defects at the Si(100)/HfO2 interface. Two clear peaks emerge in the interface state density profiles, at specific energies in the upper and lower energy gap, when the high K samples were deposited at sufficiently low temperatures to prevent hydrogen passivation of interface defects. The location of these peaks correspond to the location of Pb0 (/Pb1) defects in the Si(100)/SiO2 system. Defect densities are estimated to be of order mid 1012 cm-2 for HfO2 samples. This density is significantly higher than is the case in the Si(100)/SiO 2 system, and seems relatively independent of surface preparation steps performed. Performing a forming gas anneal at 450°C for 30 mins is not sufficient to fully passivate these interface defects, as is the case in the Si/SiO2 system.

Original languageEnglish
Pages197-206
Number of pages10
Publication statusPublished - 2003
EventPhysics and Technology of High-k Gate Dielectric I - Proceedings of the International Symposium on High Dielectric Constant Materials: Materials Science, Processing Reliability, and Manufacturing Issues - Salt Lake City, UT, United States
Duration: 20 Oct 200224 Oct 2002

Conference

ConferencePhysics and Technology of High-k Gate Dielectric I - Proceedings of the International Symposium on High Dielectric Constant Materials: Materials Science, Processing Reliability, and Manufacturing Issues
Country/TerritoryUnited States
CitySalt Lake City, UT
Period20/10/0224/10/02

Fingerprint

Dive into the research topics of 'Analysis of electrically active defects at Si(100) - HfO2 interface'. Together they form a unique fingerprint.

Cite this