Back-gate mirror doping for fully depleted planar SOI transistors with thin buried oxide

  • Ran Yan
  • , Russell Duane
  • , Pedram Razavi
  • , Aryan Afzalian
  • , Isabelle Ferain
  • , Chi Woo Lee
  • , Nima Dehdashti
  • , Bich Yen Nguyen
  • , Konstantin K. Bourdelle
  • , J. P. Colinge

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this paper, we analyze LDD depletion effects in Fully-Depleted SOI (FDSOI) devices with thin-BOX and ground plane (GP). Back-gate engineering is introduced to reduce the channel effects are rather insensitive to SOI layer thickness variations and remains well controlled for gate lengths down to 15nm.

Original languageEnglish
Title of host publicationProceedings of 2010 International Symposium on VLSI Technology, System and Application, VLSI-TSA 2010
Pages76-77
Number of pages2
DOIs
Publication statusPublished - 2010
Event2010 International Symposium on VLSI Technology, System and Application, VLSI-TSA 2010 - Hsin Chu, Taiwan, Province of China
Duration: 26 Apr 201028 Apr 2010

Publication series

NameProceedings of 2010 International Symposium on VLSI Technology, System and Application, VLSI-TSA 2010

Conference

Conference2010 International Symposium on VLSI Technology, System and Application, VLSI-TSA 2010
Country/TerritoryTaiwan, Province of China
CityHsin Chu
Period26/04/1028/04/10

Keywords

  • Back-gate engineering
  • Fully depleted silicon-on-insulation (FDSOI) MOSFET
  • LDD depletion effect
  • Thin buried-oxided (BOX)

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