@inproceedings{2c55632f98104be1b0a9ed9816248066,
title = "Bumpless interconnects formed with nanowire ACF for 3D applications",
abstract = "Nanowire ACF is fabricated by template synthesis method based on electrochemical deposition. Due to the high aspect ratio of length to diameter (50:1), the nanowires can act as compliant conductors to electrically connect the bumpless dies with a small bonding force. In this work, an interconnection resistance of 90 mΩ per 40 × 40 μm2 pad is measured for the Cu NW-ACF bonding between two Au bumpless dies. An increasing leakage current up to 10-6 A in x-y plane is observed with the elevated voltage till 20 V for a pitch size of 80 μm. A comparison study of NW-ACF to conventional particle based ACF is carried out. The bonding mechanisms of the NW-ACF bonding to bumped and bumpless dies and its difference to particle ACF bonding is revealed by bonding interface analysis.",
keywords = "Bonding interface analysis, Bumpless interconnect, Flip-chip bonding, Interconnectio resistance, Leakage current, Nanowire ACF",
author = "Jing Tao and Alan Mathewson and Razeeb, \{Kafil M.\}",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; International 3D Systems Integration Conference, 3DIC 2014 ; Conference date: 01-12-2014 Through 03-12-2014",
year = "2014",
doi = "10.1109/3DIC.2014.7152154",
language = "English",
series = "2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings",
address = "United States",
}