Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications

  • A. Vandooren
  • , Z. Wu
  • , A. Khaled
  • , J. Franco
  • , B. Parvais
  • , W. Li
  • , L. Witters
  • , A. Walke
  • , L. Peng
  • , N. Rassoul
  • , P. Matagne
  • , H. Debruyn
  • , G. Jamieson
  • , F. Inoue
  • , K. Devriendt
  • , L. Teugels
  • , N. Heylen
  • , E. Vecchio
  • , T. Zheng
  • , D. Radisic
    • E. Rosseel, W. Vanherle, A. Hikavyy, B. T. Chan, G. Besnard, W. Schwarzenbach, G. Gaudin, I. Radu, B. Y. Nguyen, N. Waldron, V. De Heyn, S. Demuynck, J. Boemmels, J. Ryckaert, N. Collaert, D. Mocuta

Research output: Chapter in Book/Report/Conference proceedings › Chapter › peer-review

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