Capacitance-Voltage Characterization of LPCVD-Silicon Oxynitride Films

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Abstract

LPCVD-silicon oxynitride films with different compositions were deposited on n-Si(111) substrates by reacting dichlorosilane (Si2H2Cl2) with nitrous oxide (N2O) and ammonia (NH3) at a temperature of 860°C varying the gas flow rate ratio of N2D and NH3. The electrical properties of the SiOxNy films were studied by analysis of the 1 MHz capacitance-voltage characteristics of the metal-SiOxNy-silicon capacitors. It has been found that with increasing amount of N2O in the deposition ambient the concentration of the dielectric charges in the SiOxNy/Si structures goes through a minimum, while the interface trap density gradually decreases. The nature of the defects is discussed.

Original languageEnglish
Pages (from-to)493-498
Number of pages6
JournalPhysica Status Solidi (A) Applied Research
Volume187
Issue number2
DOIs
Publication statusPublished - Oct 2001
Externally publishedYes

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