Challenges for introducing Ge and III/V devices into CMOS technologies

  • M. Heyns
  • , A. Alian
  • , G. Brammertz
  • , M. Caymax
  • , G. Eneman
  • , J. Franco
  • , F. Gencarelli
  • , G. Groeseneken
  • , G. Hellings
  • , A. Hikavyy
  • , M. Houssa
  • , B. Kaczer
  • , D. Lin
  • , R. Loo
  • , C. Merckling
  • , M. Meuris
  • , J. Mitard
  • , L. Nyns
  • , S. Sioncke
  • , W. Vandervorst
  • B. Vincent, N. Waldron, L. Witters

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

High mobility channel materials and new device structures will be needed to meet the power and performance specifications in future technology nodes. In these new material systems and devices various electrically active defects are present at or close to the interface between the high-k dielectric and the alternative channel material which are a major concern for both the performance and the reliability of these new devices.

Original languageEnglish
Title of host publication2012 IEEE International Reliability Physics Symposium, IRPS 2012
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages5D.1.1-5D.1.10
ISBN (Print)9781457716799
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 IEEE International Reliability Physics Symposium, IRPS 2012 - Anaheim, CA, United States
Duration: 15 Apr 201219 Apr 2012

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026

Conference

Conference2012 IEEE International Reliability Physics Symposium, IRPS 2012
Country/TerritoryUnited States
CityAnaheim, CA
Period15/04/1219/04/12

Keywords

  • CMOS
  • defects
  • Germanium
  • III/V

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