Characterisation of advanced multilayer de-embedding structures up to 50 GHz incorporating a novel validation standard

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

Modern multi-level metallisation schemes offer the possibility of many innovative structures for frequency characterisation and de-embedding. In this paper we perform a detailed charaterisation of several such structures up to 50 GHz and show their application to measurements of a high performance HBT device. We further propose a consistency check, by comparing independent DC and s-parameter measurements, to gain further confidence in the de-embedding operations.

Original languageEnglish
Title of host publication2006 International Conference on Microelectronic Test Structures - Digest of Technical Papers
Pages59-64
Number of pages6
DOIs
Publication statusPublished - 2006
Event2006 International Conference on Microelectronic Test Structures - Austin, TX, United States
Duration: 6 Mar 20069 Mar 2006

Publication series

NameIEEE International Conference on Microelectronic Test Structures
Volume2006

Conference

Conference2006 International Conference on Microelectronic Test Structures
Country/TerritoryUnited States
CityAustin, TX
Period6/03/069/03/06

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