Characterisation of Chip-on-Board and Flip Chip packaging technologies by acoustic microscopy

In recent years scanning acoustic microscopy (SAM) has been found to be a very successful technique when used in the microelectronics industry to evaluate, from a reliability perspective, standard plastic packaging technologies such as PQFP's, PLCC's, DIP's and SOP's. Very little research has been reported in the application of SAM as a technique for determining the quality and reliability of packaging technologies such as Chip-on-Board (COB) and Flip Chip adhered devices, however. These areas will be addressed in this paper.