TY - CHAP
T1 - Characterisation of Microneedle-Based ECG Electrodes Fabricated Using an Industrial Injection-Moulding Process
AU - O'Mahony, Conor
AU - Bocchino, Andrea
AU - Haslinger, Michael J.
AU - Fechtig, Daniel
AU - Schossleitner, Klaudia
AU - Galvin, Paul
AU - Brandstatter, Stefan
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - This work has produced microneedle-based electrocardiography (ECG) electrodes using a commercial, high-volume fabrication process. Specifically, we have adapted industrial injection moulding (IM) techniques to replicate silicon microneedle arrays in medical-grade cyclic olefin polymers (COP) and these, to our knowledge, are the sharpest IM microneedles produced to date. The arrays are then metallised and used as 'dry' electrodes to record ECG signals. We also show that their performance is equivalent to that of commercial electrodes, but without the need for skin preparation or electrolytic 'wet' gels. This new IM process, originally developed for the mass manufacture of compact discs (CDs), has significant implications for the future viability of microneedle-based electrodes in this very cost-competitive application.
AB - This work has produced microneedle-based electrocardiography (ECG) electrodes using a commercial, high-volume fabrication process. Specifically, we have adapted industrial injection moulding (IM) techniques to replicate silicon microneedle arrays in medical-grade cyclic olefin polymers (COP) and these, to our knowledge, are the sharpest IM microneedles produced to date. The arrays are then metallised and used as 'dry' electrodes to record ECG signals. We also show that their performance is equivalent to that of commercial electrodes, but without the need for skin preparation or electrolytic 'wet' gels. This new IM process, originally developed for the mass manufacture of compact discs (CDs), has significant implications for the future viability of microneedle-based electrodes in this very cost-competitive application.
UR - https://www.scopus.com/pages/publications/85074343843
U2 - 10.1109/MEMSYS.2019.8870721
DO - 10.1109/MEMSYS.2019.8870721
M3 - Chapter
AN - SCOPUS:85074343843
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 557
EP - 560
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -