Abstract
We report the physical and electrical characteristics of the first tantalum pentoxide dielectric films as deposited by the new technique of low pressure ultraviolet-assisted injection liquid source (UVILS) chemical vapour deposition (UVILS-CVD) using the precursor tantalum tetraethoxy dimethylaminoethoxide (Ta(OEt)4(dmae)). The films as deposited exhibit high leakage currents due to carbon impurities. Significant porosity is found at deposition temperatures below 350 °C. Conventional C-V characteristics are exhibited by thick (200 angstroms to 1000 angstroms) as-deposited films, with dielectric constants of 17.4 to 24.
| Original language | English |
|---|---|
| Pages (from-to) | 283-286 |
| Number of pages | 4 |
| Journal | Microelectronic Engineering |
| Volume | 48 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Sep 1999 |
| Event | Proceedings of the 1999 11th Biennial Conference on Insulating Films on Semiconductors (INFOS'99) - Kloster Banz, Ger Duration: 16 Jun 1999 → 19 Jun 1999 |