Characteristics of tantalum pentoxide dielectric films deposited on silicon by excimer-lamp assisted photo-induced CVD using an injection liquid source

  • M. B. Mooney
  • , P. K. Hurley
  • , B. J. O'Sullivan
  • , J. T. Beechinor
  • , J. Y. Zhang
  • , I. W. Boyd
  • , P. V. Kelly
  • , J. P. Sénateur
  • , G. M. Crean
  • , C. Jimenez
  • , M. Paillous

Research output: Contribution to journalArticlepeer-review

Abstract

We report the physical and electrical characteristics of the first tantalum pentoxide dielectric films as deposited by the new technique of low pressure ultraviolet-assisted injection liquid source (UVILS) chemical vapour deposition (UVILS-CVD) using the precursor tantalum tetraethoxy dimethylaminoethoxide (Ta(OEt)4(dmae)). The films as deposited exhibit high leakage currents due to carbon impurities. Significant porosity is found at deposition temperatures below 350 °C. Conventional C-V characteristics are exhibited by thick (200 angstroms to 1000 angstroms) as-deposited films, with dielectric constants of 17.4 to 24.

Original languageEnglish
Pages (from-to)283-286
Number of pages4
JournalMicroelectronic Engineering
Volume48
Issue number1
DOIs
Publication statusPublished - Sep 1999
EventProceedings of the 1999 11th Biennial Conference on Insulating Films on Semiconductors (INFOS'99) - Kloster Banz, Ger
Duration: 16 Jun 199919 Jun 1999

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