Abstract
In this work, we investigate the directly bonded germanium-silicon interfaces to facilitate the development of high quality germanium silicon hetero integration at the wafer scale. X-ray photoelectron spectroscopy data is presented which provides the chemical composition of the germanium surfaces as a function of the hydrophilic bonding reaction at the interface. The bonding process induced long range deformation is detected by synchrotron x-ray topography. The hetero-interface is characterized by measuring forward and reverse current, and by high resolution transmission electron microscopy.
| Original language | English |
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| Article number | 123529 |
| Journal | Journal of Applied Physics |
| Volume | 109 |
| Issue number | 12 |
| DOIs | |
| Publication status | Published - 15 Jun 2011 |