@inbook{f17e698bff904e5897b77ab6c9316751,
title = "Correlation of shear stress and metal shift: a modeling approach",
abstract = "This paper uses three dimensional finite element methods to determine the thermo-mechanically induced encapsulation stress in a 160 lead plastic quad flat pack. Comparisons are made between the effects of different leadframe materials on die stress. The degree of discretization of the leadframe necessary to accurately model it's effect on die stress is determined. A strong correlation between metal shift and out of plane shear stress is proposed following comparisons of F.E. package modeling and experimentally measured metal shift patterns on specially developed test die.",
author = "G. Kelly and C. Lyden and Mathuna, \{C. O.\} and O. Slattery and T. Hayes",
year = "1993",
language = "English",
isbn = "0780307941",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Publ by IEEE",
pages = "264--269",
booktitle = "Proceedings - Electronic Components and Technology Conference",
note = "1993 Proceedings of the 43rd Electronic Components and Technology Conference ; Conference date: 01-06-1993 Through 04-06-1993",
}