@inproceedings{3bf36be6801941a089254cb9a4c91ee5,
title = "Creep-resistant nanocrystalline gold-vanadium alloyed microcorrugated diaphragms (MCDS)",
abstract = "This paper presents new microcorrugated diaphragms (MCDs) capable of achieving large displacements (>20 μm) with the lowest reported stress relaxation today. These MCDs are fabricated by co-sputtering of gold (Au) and vanadium (V) followed by a 2-hour annealing at 300 °C. Compared to conventional RF MEMS sputtered Au films, the reported MCDs exhibit a 1.8× and a 10.5× lower stress relaxation rates at the 3rd and the 12th hour, respectively. The developed Au-V films demonstrate more than 50\% smaller average grain size than pure Au, excellent process compatibility, and significantly lower stress relaxation rate. As a result, they are very promising in improving reliability issues of widely tuned RF MEMS devices.",
keywords = "Annealing, co-sputtering, creep-resistant, gold-vanadium, grain size, microcorrugated diaphragm, nanocrystalline, RF MEMS, stress relaxation",
author = "Jin Li and Zhengan Yang and Dimitra Psychogiou and Sinanis, \{Michael D.\} and Dimitrios Peroulis",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 ; Conference date: 21-06-2015 Through 25-06-2015",
year = "2015",
month = aug,
day = "5",
doi = "10.1109/TRANSDUCERS.2015.7181066",
language = "English",
series = "2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "888--891",
booktitle = "2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015",
address = "United States",
}