Cryogenic packaging for scalable hybrid quantum PICs

  • Robert Bernson
  • , Alexander Witte
  • , Genevieve Clark
  • , Kamil Gradkowski
  • , Matthew Saha
  • , Andrew Leenheer
  • , Kevin Chen
  • , Gerald Gilbert
  • , Matt Eichenfield
  • , Dirk Englund
  • , Peter O'Brien

Research output: Contribution to conferencePaperpeer-review

Abstract

We demonstrate a robust packaging method for PICs using surface grating couplers. We use this method to create diamond color center quantum memory modules with active photon routing, strain tuning, and operation to millikelvin temperatures.

Original languageEnglish
Publication statusPublished - 2024
Event2024 Frontiers in Optics, FiO 2024 - Denver, United States
Duration: 23 Sep 202426 Sep 2024

Conference

Conference2024 Frontiers in Optics, FiO 2024
Country/TerritoryUnited States
CityDenver
Period23/09/2426/09/24

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