Cu electrodeposition from methanesulfonate electrolytes for ULSI and MEMS applications

Engineering

• Microelectromechanical System 100%
• Scale Integration 100%
• Seed Layer 50%
• Photoresist 50%
• Void Growth 50%
• Diffusion Coefficient 50%
• Nanorod 50%
• Glassy Carbon 50%
• Si Substrate 50%
• Potential Application 50%
• Aluminum Oxide 50%
• One Dimensional 50%
• Acid Electrolyte 50%
• Electrical Interconnects 50%

Material Science

• Electrodeposition 100%
• Nucleation 100%
• Microelectromechanical System 100%
• Aluminum Oxide 50%
• Nanorod 50%
• Diffusivity 50%
• Carbon Electrode 50%
• Void Growth 50%
• Glassy Carbon 50%
• Metal Deposition 50%

Chemical Engineering

• Electrodeposition 100%
• Microelectromechanical System 100%
• Sulfuric Acid 100%
• Nanorod 50%