Deep level transient spectroscopy of ultra shallow junctions in Si formed by implantation

  • N. Mitromara
  • , J. H. Evans-Freeman
  • , R. Duffy

Research output: Contribution to journalArticlepeer-review

Abstract

We have carried out DLTS in highly doped p+n Ultra Shallow Junctions (USJ) in Si formed by ion implantation. The samples were implanted either with a 10keV or a 5keV B implant at a dose of 5*10 15cm15. The 10keV sample was also implanted with P and the 5keV samples were implanted with P and increasing doses of As to simulate an USJ in an n-well. Due to the high P and/or As implant doses, it was observed that a band offset also exists between the n-type implanted region and the n-type starting material. Therefore these samples contain another depletion region apart from the expected p+n depletion region. However, the electric fields in these regions act in opposite directions assisting the profiling of different regions after careful selection of biasing conditions. A deep state is observed in the n-type region at EC-0.34eV which has a complex Laplace DLTS signature, which has arisen due to the implantation process.

Original languageEnglish
Pages (from-to)497-502
Number of pages6
JournalSolid State Phenomena
Volume131-133
Publication statusPublished - 2008
Externally publishedYes
Event12th International Autumn Meeting: Gettering and Defect Engineering in Semiconductor Technology, GADEST 2007 - Erice, Italy
Duration: 14 Oct 200719 Oct 2007

Keywords

  • DLTS
  • Ion implantation
  • Si
  • Ultra shallow

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