Defect evolution and C+/F+ Co-implantation in millisecond flash annealed ultra-shallow junctions

  • F. Cristiano
  • , E. M. Bazizi
  • , P. F. Fazzini
  • , S. Paul
  • , W. Lerch
  • , S. Boninelli
  • , R. Duffy
  • , A. Pakfar
  • , H. Bourdon
  • , F. Milesi

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this paper, we investigate the evolution of extended defects during a msec Flash anneal after a PAI implant and show that during the ultra-fast temperature ramp-up and rump-down, the basic mechanisms that control the evolution of defects are not modified with respect to the relatively slower RTA anneals. In addition, we show that junction depths below 15 nm can be achieved using a USJ fabrication scheme based on the combination of impurity co-implantation with msec Flash anneal.

Original languageEnglish
Title of host publicationIWJT-2008 - Extended Abstracts 2008 International Workshop on Junction Technology
Pages114-119
Number of pages6
DOIs
Publication statusPublished - 2008
Externally publishedYes
EventIWJT-2008 - International Workshop on Junction Technology - Shanghai, China
Duration: 15 May 200816 May 2008

Publication series

NameIWJT-2008 - Extended Abstracts 2008 International Workshop on Junction Technology

Conference

ConferenceIWJT-2008 - International Workshop on Junction Technology
Country/TerritoryChina
CityShanghai
Period15/05/0816/05/08

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