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Defect profiling of Al2O3-passivated InGaP layers via planar test structures

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Abstract

The electrically active defects in Al2O3-passivated InGaP layers, representative of an AlInGaP red micro-light-emitting diodes (μ-LED) sidewall, are characterized by using planar metal/insulator/semiconductor (MIS) capacitors test structures. The use of a planar test structure avoids the complexity of the full μ-LED device analysis and enables the selective InGaP/Al2O3 system characterization. The electrically active defects of InGaP/Al2O3/Ni MIS test structures, subject to different surface treatments, are investigated by multifrequency capacitance-voltage (CV) and conductance-voltage (GV) curves analysis. Trap levels located in the InGaP and in the Al2O3 are detected and profiled. The effect of the surface treatment (either no treatment, wet etching, or dry etching) on the detected traps is reported.

Original languageEnglish
Title of host publication2026 38th IEEE International Conference on Microelectronic Test Structures, ICMTS 2026 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798319530103
DOIs
Publication statusPublished - 2026
Event38th IEEE International Conference on Microelectronic Test Structures, ICMTS 2026 - Matsue, Japan
Duration: 23 Mar 202626 Mar 2026

Publication series

NameIEEE International Conference on Microelectronic Test Structures
ISSN (Print)1071-9032
ISSN (Electronic)2158-1029

Conference

Conference38th IEEE International Conference on Microelectronic Test Structures, ICMTS 2026
Country/TerritoryJapan
CityMatsue
Period23/03/2626/03/26

Keywords

  • AlO
  • defect
  • InGaP
  • sidewall
  • trap
  • μ-LED

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