Design and fabrication of a 315 μΗ bondwire micro-transformer for ultra-low voltage energy harvesting

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Abstract

This paper presents a design study of a new topology for miniaturized bondwire transformers fabricated and assembled with standard IC bonding wires and toroidal ferrite (Fair-Rite 5975000801) as a magnetic core. The microtransformer realized on a PCB substrate, enables the build of magnetics on-top-of-chip, thus leading to the design of high power density components. Impedance measurements in a frequency range between 100 kHz to 5 MHz, show that the secondary self-inductance is enhanced from 0.3 μH with an epoxy core to 315 μH with the ferrite core. Moreover, the micro-machined ferrite improves the coupling coefficient from 0.1 to 0.9 and increases the effective turns ratio from 0.5 to 35. Finally, a low-voltage IC DC-DC converter solution, with the transformer mounted on-top, is proposed for energy harvesting applications.

Original languageEnglish
Title of host publicationProceedings - Design, Automation and Test in Europe, DATE 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9783981537024
DOIs
Publication statusPublished - 2014
Event17th Design, Automation and Test in Europe, DATE 2014 - Dresden, Germany
Duration: 24 Mar 201428 Mar 2014

Publication series

NameProceedings -Design, Automation and Test in Europe, DATE
ISSN (Print)1530-1591

Conference

Conference17th Design, Automation and Test in Europe, DATE 2014
Country/TerritoryGermany
CityDresden
Period24/03/1428/03/14

Keywords

  • bonding wires
  • bondwire
  • converter
  • DC-DC
  • energy harvesting
  • ferrite
  • magnetics
  • on-chip
  • PCB
  • transformer

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