@inbook{6a4000d7044f4131963a597d6fda0772,
title = "Design considerations for multi-chip module silicon-photonic transceivers",
abstract = "High bandwidth density silicon photonic interconnects offer the potential to address the massive increase in bandwidth demands for data center traffic and high performance computing. One of the major challenges in realizing silicon photonics transceivers is the integration and packing of photonic ICs (PIC) with electronic ICs (EIC). This paper presents our version one, 2.5D integrated multi-chip module (MCM) transceiver for 4 channel wavelength division multiplexing (WDM) operation, targeting 10 Gbps per channel. We identify five key areas critical to successful integration of MCM transceivers, which we have used in developing our version two MCM transceiver: integration architecture, equivalent circuit model development, PIC to EIC interface modelling, MCM I/O design, and design for assembly.",
keywords = "2.5D Integration, Interposer, Multi-Chip Module, Optical Interconnects, Silicon Photonics, Wavelength Division Multiplexing",
author = "Abrams, \{Nathan C.\} and Qixiang Cheng and Madeleine Glick and Evgeny Manzhosov and Moises Jezzini and Padraic Morrissey and Peter O'Brien and Keren Bergman",
note = "Publisher Copyright: {\textcopyright} 2020 SPIE.; Metro and Data Center Optical Networks and Short-Reach Links III 2020 ; Conference date: 05-02-2020 Through 06-02-2020",
year = "2020",
doi = "10.1117/12.2544008",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Srivastava, \{Atul K.\} and Madeleine Glick and Youichi Akasaka",
booktitle = "Metro and Data Center Optical Networks and Short-Reach Links III",
address = "United States",
}