Abstract
The key contender packaging systems for high specification surface mountable (SMT) DC-DC converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. The thermal performance comparison data are presented. Mechanical performance criteria, evaluating the converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.
| Original language | English |
|---|---|
| Pages | 318-324 |
| Number of pages | 7 |
| DOIs | |
| Publication status | Published - 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99 - Dallas, TX, USA Duration: 14 Mar 1999 → 18 Mar 1999 |
Conference
| Conference | Proceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99 |
|---|---|
| City | Dallas, TX, USA |
| Period | 14/03/99 → 18/03/99 |