Design considerations for surface mountable DC-DC converters

Research output: Contribution to conferencePaperpeer-review

Abstract

The key contender packaging systems for high specification surface mountable (SMT) DC-DC converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. The thermal performance comparison data are presented. Mechanical performance criteria, evaluating the converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.

Original languageEnglish
Pages318-324
Number of pages7
DOIs
Publication statusPublished - 1999
Externally publishedYes
EventProceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99 - Dallas, TX, USA
Duration: 14 Mar 199918 Mar 1999

Conference

ConferenceProceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99
CityDallas, TX, USA
Period14/03/9918/03/99

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