Design considerations for surface mountable DC-DC converters

Seamus O'Driscoll; Bernard McDermott

doi:10.1109/apec.1999.749668

Design considerations for surface mountable DC-DC converters

Seamus O'Driscoll
, Bernard McDermott

Artesyn Technologies

Research output: Contribution to conference › Paper › peer-review

Abstract

The key contender packaging systems for high specification surface mountable (SMT) DC-DC converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. The thermal performance comparison data are presented. Mechanical performance criteria, evaluating the converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.

Original language	English
Pages	318-324
Number of pages	7
DOIs	https://doi.org/10.1109/apec.1999.749668
Publication status	Published - 1999
Externally published	Yes
Event	Proceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99 - Dallas, TX, USA Duration: 14 Mar 1999 → 18 Mar 1999

Conference

Conference	Proceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99
City	Dallas, TX, USA
Period	14/03/99 → 18/03/99

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1109/apec.1999.749668

Cite this

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title = "Design considerations for surface mountable DC-DC converters",

abstract = "The key contender packaging systems for high specification surface mountable (SMT) DC-DC converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. The thermal performance comparison data are presented. Mechanical performance criteria, evaluating the converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.",

author = "Seamus O'Driscoll and Bernard McDermott",

year = "1999",

doi = "10.1109/apec.1999.749668",

language = "English",

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note = "Proceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99 ; Conference date: 14-03-1999 Through 18-03-1999",

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AU - McDermott, Bernard

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AB - The key contender packaging systems for high specification surface mountable (SMT) DC-DC converters are reviewed. Various substrate, leadout and encasing options are examined for reliability and true surface mountability. Both open-frame and moulded designs are studied. The thermal performance comparison data are presented. Mechanical performance criteria, evaluating the converter as an SMT component are outlined. Manufacturing and end-user process issues are discussed. Electrical design caveats are outlined.

UR - https://www.scopus.com/pages/publications/0032661730

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DO - 10.1109/apec.1999.749668

M3 - Paper

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T2 - Proceedings of the 1999 14th annual Applied Power Electronics Conference and Exposition, APEC'99

Y2 - 14 March 1999 through 18 March 1999

ER -

Design considerations for surface mountable DC-DC converters

Abstract

Conference

UN SDGs

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