Design, manufacture and testing of a low-cost micro-channel cooling device

A. J. Pang; M. P.Y. Desmulliez; M. Leonard; R. S. Dhariwal; R. L. Reuben; A. S. Holmes; G. Hong; K. R. Pullen; F. Waldron; O. Slattery; M. Rencz; D. R. Emerson; R. W. Barber

Design, manufacture and testing of a low-cost micro-channel cooling device

A. J. Pang
, M. P.Y. Desmulliez
, M. Leonard
, R. S. Dhariwal
, R. L. Reuben
, A. S. Holmes
, G. Hong
, K. R. Pullen
, F. Waldron
, O. Slattery
, M. Rencz
, D. R. Emerson
, R. W. Barber

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented.

Original language	English
Title of host publication	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
Editors	K.C. Toh, Y.C. Mui, J. How, J.H.L. Pang
Pages	564-568
Number of pages	5
Publication status	Published - 2004
Event	6th Electronics Packaging Technology Conference, EPTC 2004 - Singapore, Singapore Duration: 8 Dec 2005 → 10 Dec 2005

Publication series

Name	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Conference

Conference	6th Electronics Packaging Technology Conference, EPTC 2004
Country/Territory	Singapore
City	Singapore
Period	8/12/05 → 10/12/05

Cite this

Pang, A. J., Desmulliez, M. P. Y., Leonard, M., Dhariwal, R. S., Reuben, R. L., Holmes, A. S., Hong, G., Pullen, K. R., Waldron, F., Slattery, O., Rencz, M., Emerson, D. R., & Barber, R. W. (2004). Design, manufacture and testing of a low-cost micro-channel cooling device. In K. C. Toh, Y. C. Mui, J. How, & J. H. L. Pang (Eds.), Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 (pp. 564-568). Article E5.3 (Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004).

@inproceedings{62d8f83d243746b8861b0e9b6545ed53,

title = "Design, manufacture and testing of a low-cost micro-channel cooling device",

abstract = "The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented.",

author = "Pang, \{A. J.\} and Desmulliez, \{M. P.Y.\} and M. Leonard and Dhariwal, \{R. S.\} and Reuben, \{R. L.\} and Holmes, \{A. S.\} and G. Hong and Pullen, \{K. R.\} and F. Waldron and O. Slattery and M. Rencz and Emerson, \{D. R.\} and Barber, \{R. W.\}",

year = "2004",

language = "English",

isbn = "0780388216",

series = "Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004",

pages = "564--568",

editor = "K.C. Toh and Y.C. Mui and J. How and J.H.L. Pang",

booktitle = "Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004",

note = "6th Electronics Packaging Technology Conference, EPTC 2004 ; Conference date: 08-12-2005 Through 10-12-2005",

}

Pang, AJ, Desmulliez, MPY, Leonard, M, Dhariwal, RS, Reuben, RL, Holmes, AS, Hong, G, Pullen, KR, Waldron, F, Slattery, O, Rencz, M, Emerson, DR & Barber, RW 2004, Design, manufacture and testing of a low-cost micro-channel cooling device. in KC Toh, YC Mui, J How & JHL Pang (eds), Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004., E5.3, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, pp. 564-568, 6th Electronics Packaging Technology Conference, EPTC 2004, Singapore, Singapore, 8/12/05.

Design, manufacture and testing of a low-cost micro-channel cooling device. / Pang, A. J.; Desmulliez, M. P.Y.; Leonard, M. et al.
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. ed. / K.C. Toh; Y.C. Mui; J. How; J.H.L. Pang. 2004. p. 564-568 E5.3 (Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Design, manufacture and testing of a low-cost micro-channel cooling device

AU - Pang, A. J.

AU - Desmulliez, M. P.Y.

AU - Leonard, M.

AU - Dhariwal, R. S.

AU - Reuben, R. L.

AU - Holmes, A. S.

AU - Hong, G.

AU - Pullen, K. R.

AU - Waldron, F.

AU - Slattery, O.

AU - Rencz, M.

AU - Emerson, D. R.

AU - Barber, R. W.

PY - 2004

Y1 - 2004

N2 - The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented.

AB - The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented.

UR - https://www.scopus.com/pages/publications/28144463143

M3 - Conference proceeding

AN - SCOPUS:28144463143

SN - 0780388216

SN - 9780780388215

T3 - Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

SP - 564

EP - 568

BT - Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

A2 - Toh, K.C.

A2 - Mui, Y.C.

A2 - How, J.

A2 - Pang, J.H.L.

T2 - 6th Electronics Packaging Technology Conference, EPTC 2004

Y2 - 8 December 2005 through 10 December 2005

ER -

Pang AJ, Desmulliez MPY, Leonard M, Dhariwal RS, Reuben RL, Holmes AS et al. Design, manufacture and testing of a low-cost micro-channel cooling device. In Toh KC, Mui YC, How J, Pang JHL, editors, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. 2004. p. 564-568. E5.3. (Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004).

Design, manufacture and testing of a low-cost micro-channel cooling device

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