TY - GEN
T1 - Design of BGA style Glass Interposer for 2.5D integration of photonic ICs
AU - Kumar, D. S.
AU - Hall, M. L.
AU - He, X.
AU - Morrissey, P.
AU - O'Brien, P.
AU - Krohnert, K.
AU - Böttger, Gunnar
AU - Schiffer, M.
AU - Schneider-Ramelow, M.
AU - Schöning, N.
AU - Schulz-Ruthenberg, M.
AU - Ambrosius, N.
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Integrating PICs using standardized packaging processes remain a challenge. Access to multiple facets of the PIC is required for optical I/Os. We present the 2.5D integration of silicon PIC on glass interposer using BGA. Electrical fanout was designed while still allowing for these optical I/Os. Full package will incorporate in-package laser diode with beam shaping micro-optics, and hermetic sealing.
AB - Integrating PICs using standardized packaging processes remain a challenge. Access to multiple facets of the PIC is required for optical I/Os. We present the 2.5D integration of silicon PIC on glass interposer using BGA. Electrical fanout was designed while still allowing for these optical I/Os. Full package will incorporate in-package laser diode with beam shaping micro-optics, and hermetic sealing.
KW - disruptive Surface Mounting Technology (SMT)
KW - Flip-chip in Package (FCIP)
KW - Heterogeneous Integration (HI) towards 3D packaging Technologies
KW - high-aspect ratio Through Glass Vias (TGVs)
KW - Re-distribution Layers (RDLs)
KW - Systems in Package (SIP)
KW - Wafer Level packaging (WLP)
UR - https://www.scopus.com/pages/publications/85215525825
U2 - 10.1109/IPC60965.2024.10799522
DO - 10.1109/IPC60965.2024.10799522
M3 - Conference proceeding
AN - SCOPUS:85215525825
T3 - 2024 IEEE Photonics Conference, IPC 2024 - Proceedings
BT - 2024 IEEE Photonics Conference, IPC 2024 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE Photonics Conference, IPC 2024
Y2 - 10 November 2024 through 14 November 2024
ER -