Abstract
A simple two-terminal method is described for the determination of generation lifetime in intrinsic polycrystalline silicon suitable for thin-film transistor applications using a metal/SiO2 /polycrystalline silicon/n-type silicon test structure. The method consists of monitoring the high-frequency capacitance of the test structure after the application of a voltage pulse of the correct polarity to cause deep depletion in the n-type substrate. Generation lifetimes of 34 ps to 19 ns are obtained for polycrystalline silicon films of varying grain size.
| Original language | English |
|---|---|
| Pages (from-to) | 1525-1527 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 54 |
| Issue number | 16 |
| DOIs | |
| Publication status | Published - 1989 |
| Externally published | Yes |
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