Determination of physical parameters for HfO2/SiO x/TiN MOSFET gate stacks by electrical characterization and reverse modeling

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

In this paper we present the results of a combined electrical and modeling study to determine the tunneling electron effective mass and electron affinity for HfO2. Experimental capacitance-voltage (C-V) and current-voltage (I-V) characteristics are presented for HfD2 films deposited on Si(100) substrates by atomic layer deposition (ALD) and electron beam evaporation (e-beam), with equivalent oxide thickness in the range 10 and 12.5Å. We extend on previous studies by applying a self-consistent 1D-Schrödinger-Poisson solver to the entire gate stack, including the inter-layer SiOx region and to the adjacent substrate for non-local barrier tunneling selfconsistently linked to the quantum-drift-diffusion transport model. The reverse modeling is applied to the correlated gate and drain currents in long channel MOSFET structures. Values of 0.11 ± (0.03) mo and 2.0 ± (0.25) eV were determined for the HfO 2 electron effective mass and electron affinity.

Original languageEnglish
Title of host publicationULIS 2008 - 9th International Conference on ULtimate Integration of Silicon
Pages107-110
Number of pages4
DOIs
Publication statusPublished - 2008
Event9th International Conference on ULtimate Integration of Silicon, ULIS 2008 -
Duration: 13 Mar 200814 Mar 2008

Publication series

NameULIS 2008 - 9th International Conference on ULtimate Integration of Silicon

Conference

Conference9th International Conference on ULtimate Integration of Silicon, ULIS 2008
Period13/03/0814/03/08

Keywords

  • Electron affinity
  • Electron effective mass
  • HfO
  • High-k gate stacks
  • Reverse modeling
  • Tunneling

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