Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration

Kevin Shortiss; How Yuan Hwang; Josue Parra-Cetina; Moritz Seyfried; Peter O'Brien

Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration

Kevin Shortiss
, How Yuan Hwang
, Josue Parra-Cetina
, Moritz Seyfried
, Peter O'Brien

Research output: Contribution to conference › Paper › peer-review

Abstract

We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.

Original language	English
Publication status	Published - 2024
Event	2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024 - Incheon, Korea, Republic of Duration: 4 Aug 2024 → 8 Aug 2024

Conference

Conference	2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024
Country/Territory	Korea, Republic of
City	Incheon
Period	4/08/24 → 8/08/24

Cite this

@conference{52cdeb743d2643a3a39f0e0d90f6a3be,

title = "Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration",

abstract = "We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.",

author = "Kevin Shortiss and Hwang, \{How Yuan\} and Josue Parra-Cetina and Moritz Seyfried and Peter O'Brien",

note = "Publisher Copyright: {\textcopyright} 2024 The Authors.; 2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024 ; Conference date: 04-08-2024 Through 08-08-2024",

year = "2024",

language = "English",

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TY - CONF

T1 - Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration

AU - Shortiss, Kevin

AU - Hwang, How Yuan

AU - Parra-Cetina, Josue

AU - Seyfried, Moritz

AU - O'Brien, Peter

PY - 2024

Y1 - 2024

N2 - We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.

AB - We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.

UR - https://www.scopus.com/pages/publications/85216127982

M3 - Paper

AN - SCOPUS:85216127982

T2 - 2024 Conference on Lasers and Electro-Optics/Pacific Rim, CLEO-PR 2024

Y2 - 4 August 2024 through 8 August 2024

ER -

Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration

Abstract

Conference

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