@inbook{64749002e9514bbaa10c963f2734666d,
title = "Development of 808 nm Laser-Assisted-Bonding (LAB) for Photonic System-in-Package Integration",
abstract = "We describe a versatile laser-assisted bonding (LAB) system for photonic system-in-package integration using an 808 nm laser. This paper details the LAB process for flip chip bonding of Si and InP PICs onto glass interposers.",
author = "Kevin Shortiss and Hwang, \{How Yuan\} and Josue Parra-Cetina and Moritz Seyfried and Peter Obrien",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 16th Pacific Rim Conference on Lasers and Electro-Optics, CLEO-PR 2024 ; Conference date: 04-08-2024 Through 09-08-2024",
year = "2024",
doi = "10.1109/CLEO-PR60912.2024.10676851",
language = "English",
series = "16th Pacific Rim Conference on Lasers and Electro-Optics, CLEO-PR 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "16th Pacific Rim Conference on Lasers and Electro-Optics, CLEO-PR 2024",
address = "United States",
}