@inbook{046f00ee8a624f089bf6a763dbfa81e7,
title = "Development of Electrical and Optical Packaging for Silicon Photonic MEMS",
abstract = "We demonstrate a packaging approach to integrate electrical and optical connections in silicon photonic MEMS, utilizing a custom-designed silicon interposer for routing over 118 electrical connections and a 72 channel fiber array to couple to on-chip fiber grating couplers with minimal transmission loss at 1543 nm wavelength.",
keywords = "flip chip, MEMS, Silicon interposer, silicon photonics",
author = "Mallik, \{Arun Kumar\} and Lee, \{Jun Su\} and Sean Collins and Cleitus Antony and Umar Khan and Pierre Edinger and Gaehun Jo and Iman Zand and Frank Niklaus and Gylfason, \{Kristinn B.\} and Niels Quack and Wim Bogaerts and Morissay, \{Padraic E.\} and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE Photonics Conference, IPC 2024 ; Conference date: 10-11-2024 Through 14-11-2024",
year = "2024",
doi = "10.1109/IPC60965.2024.10799857",
language = "English",
series = "2024 IEEE Photonics Conference, IPC 2024 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 IEEE Photonics Conference, IPC 2024 - Proceedings",
address = "United States",
}