@inproceedings{95d92a715543404c92bf6e6e4e871dbc,
title = "Development of integrated photonic packaging standards and foundry capabilities",
abstract = "An overview of Si and InP PIC packaging standards and foundry capabilities led by researchers at the Tyndall Institute in collaboration with European partners will be presented. Details of optical and electrical packaging techniques will be reviewed.",
author = "Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} OSA 2016.; Frontiers in Optics, FiO 2016 ; Conference date: 17-10-2016 Through 21-10-2016",
year = "2016",
doi = "10.1364/FIO.2016.FF3E.2",
language = "English",
isbn = "9781943580194",
series = "Optics InfoBase Conference Papers",
publisher = "Optica Publishing Group (formerly OSA)",
booktitle = "Frontiers in Optics, FiO 2016",
address = "United States",
}