Development of Micro-Thermoelectric Generators for Powering Wearable Devices

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Abstract

In this work, we demonstrate and discuss the fabrication and performance of the micro thermoelectric generator (micro-TEG) for near room temperature on-body applications. A device size of 3.5 × 4.5 mm2 is fabricated with two unique approaches: flip-chip bonding approach and suspended bridge device on a single silicon wafer. Both top and bottom gold (Au) interconnect, p-type CuSbTe and n-type Bi2Te3 thermoelectric materials are grown by the electrodeposition process. Flip-chip bonding delivers robust devices that can be directly used for the energy harvesting applications. This device, at a temperature gradient of 5 K and 10 K delivers a voltage output of 46 and 85 mV, respectively. A power density of 11.32 and 40.13 µW/cm2 is achieved for those two temperature gradients. Thus, the micro-TEG developed in this work can offer a platform for providing electrical energy for wearable IoT devices.

Original languageEnglish
Article number125579
JournalApplied Thermal Engineering
Volume265
DOIs
Publication statusPublished - 15 Apr 2025

Keywords

  • Electrodeposition
  • Energy harvesting
  • Flip-chip bonding
  • Micro-thermoelectric generator

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